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PAL16R4NC

Specifications

SKU: 11648507

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Parameter Description Value
Device Type Programmable Array Logic (PAL) 16R4
Package Ceramic Dual-In-Line Package (CERDIP) 20-Pin
Operating Voltage Supply voltage range 4.5V to 5.5V
Operating Temperature Temperature range for operation -55°C to 125°C
Storage Temperature Temperature range for storage -65°C to 150°C
Maximum Power Maximum power dissipation 750mW
Propagation Delay Typical propagation delay time 12ns
Input Current Maximum input current ±10mA
Output Current Maximum output current ±25mA
Fan-out Number of standard TTL loads that can be driven 10
Programming Voltage Voltage required for programming 12.6V
Erase Time Time required for erasing the device 10 minutes
Programming Time Time required for programming the device 100ms

Instructions for Use:

  1. Power Supply:

    • Connect the VCC pin to a stable 5V supply.
    • Connect the GND pin to ground.
  2. Programming:

    • Use a PAL programmer capable of providing the required 12.6V programming voltage.
    • Follow the specific programming algorithm provided by the manufacturer.
    • Ensure the device is properly erased before programming.
  3. Input Handling:

    • Apply logic levels within the specified voltage range to input pins.
    • Ensure input currents do not exceed ±10mA to prevent damage.
  4. Output Handling:

    • Connect load devices to the output pins, ensuring the total current does not exceed ±25mA.
    • Use appropriate pull-up or pull-down resistors if necessary.
  5. Temperature Considerations:

    • Operate the device within the specified temperature range to ensure reliable performance.
    • Store the device in a controlled environment to avoid damage from extreme temperatures.
  6. Handling Precautions:

    • Handle the device with care to avoid static discharge.
    • Use proper ESD protection measures during handling and installation.
  7. Mounting:

    • Ensure proper alignment of the device on the PCB.
    • Solder the device using a temperature-controlled soldering iron to avoid thermal stress.
  8. Testing:

    • After installation, test the device under normal operating conditions to verify functionality.
    • Use diagnostic tools to check for any shorts or open circuits.
(For reference only)

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