Specifications
SKU: 11648533
Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
Supply Voltage | Vcc | Operating | 2.7 | - | 5.5 | V |
Operating Current | Icc | Vcc = 5V | - | 300 | - | μA |
Output Voltage | Vo | Vcc = 5V, No Load | 3.0 | - | 3.3 | V |
Output Current | Io | Continuous | - | 100 | - | mA |
Quiescent Current | Iq | Vcc = 5V | - | 10 | - | μA |
Dropout Voltage | Vdo | Io = 100mA | - | 0.3 | - | V |
Load Regulation | ΔVo/ΔI | Io = 0 to 100mA | - | 0.01 | - | % |
Line Regulation | ΔVo/ΔV | Vcc = 2.7 to 5.5V | - | 0.01 | - | % |
Ripple Rejection | RR | 10Hz to 100kHz | - | 60 | - | dB |
Operating Temperature | Toper | - | -40 | - | 85 | °C |
Storage Temperature | Tstg | - | -55 | - | 125 | °C |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (Vcc) is within the range of 2.7V to 5.5V.
- Use a stable power source to avoid fluctuations that could affect performance.
Output Configuration:
- Connect the output (Vo) to the load directly.
- Ensure the load current (Io) does not exceed 100mA continuously.
Decoupling Capacitors:
- Place a 1μF ceramic capacitor between Vcc and ground as close to the device as possible to reduce noise and improve stability.
- Optionally, place a 10μF electrolytic capacitor between Vcc and ground for additional filtering.
Thermal Considerations:
- The device can operate over a wide temperature range (-40°C to 85°C). However, ensure adequate heat dissipation if operating at high currents or in high ambient temperatures.
Output Voltage Regulation:
- The device provides good load and line regulation, ensuring stable output voltage under varying conditions.
- The ripple rejection is effective over a wide frequency range, reducing the impact of input voltage noise on the output.
Storage:
- Store the device in a dry environment within the temperature range of -55°C to 125°C to maintain its performance characteristics.
Handling:
- Handle the device with care to avoid static damage. Use proper ESD protection measures when handling and soldering the device.
Mounting:
- Follow standard surface mount technology (SMT) procedures for mounting the device on the PCB.
- Ensure proper soldering to avoid cold joints and ensure reliable electrical connections.
Inquiry - HM4716AP-3