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HM4716AP-3

Specifications

SKU: 11648533

BUY HM4716AP-3 https://www.utsource.net/itm/p/11648533.html

Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage Vcc Operating 2.7 - 5.5 V
Operating Current Icc Vcc = 5V - 300 - μA
Output Voltage Vo Vcc = 5V, No Load 3.0 - 3.3 V
Output Current Io Continuous - 100 - mA
Quiescent Current Iq Vcc = 5V - 10 - μA
Dropout Voltage Vdo Io = 100mA - 0.3 - V
Load Regulation ΔVo/ΔI Io = 0 to 100mA - 0.01 - %
Line Regulation ΔVo/ΔV Vcc = 2.7 to 5.5V - 0.01 - %
Ripple Rejection RR 10Hz to 100kHz - 60 - dB
Operating Temperature Toper - -40 - 85 °C
Storage Temperature Tstg - -55 - 125 °C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the range of 2.7V to 5.5V.
    • Use a stable power source to avoid fluctuations that could affect performance.
  2. Output Configuration:

    • Connect the output (Vo) to the load directly.
    • Ensure the load current (Io) does not exceed 100mA continuously.
  3. Decoupling Capacitors:

    • Place a 1μF ceramic capacitor between Vcc and ground as close to the device as possible to reduce noise and improve stability.
    • Optionally, place a 10μF electrolytic capacitor between Vcc and ground for additional filtering.
  4. Thermal Considerations:

    • The device can operate over a wide temperature range (-40°C to 85°C). However, ensure adequate heat dissipation if operating at high currents or in high ambient temperatures.
  5. Output Voltage Regulation:

    • The device provides good load and line regulation, ensuring stable output voltage under varying conditions.
    • The ripple rejection is effective over a wide frequency range, reducing the impact of input voltage noise on the output.
  6. Storage:

    • Store the device in a dry environment within the temperature range of -55°C to 125°C to maintain its performance characteristics.
  7. Handling:

    • Handle the device with care to avoid static damage. Use proper ESD protection measures when handling and soldering the device.
  8. Mounting:

    • Follow standard surface mount technology (SMT) procedures for mounting the device on the PCB.
    • Ensure proper soldering to avoid cold joints and ensure reliable electrical connections.
(For reference only)

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