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L4936

Specifications

SKU: 11651625

BUY L4936 https://www.utsource.net/itm/p/11651625.html

Parameter Symbol Conditions Min Typ Max Unit
Input Voltage VIN 2.5 40 V
Output Voltage VOUT 1.2 35 V
Output Current IOUT 1.5 A
Quiescent Current IQ VIN = 5V, VOUT = 5V 80 μA
Dropout Voltage VD IOUT = 150mA 0.7 V
Reference Voltage VREF 1.24 V
Power Dissipation PD 15 W
Operating Temperature TOPR -40 125 °C
Storage Temperature TSTG -65 150 °C

Instructions for Using L4936

  1. Input Voltage (VIN):

    • Ensure the input voltage is within the range of 2.5V to 40V.
    • Use appropriate filtering capacitors (e.g., 10μF) to stabilize the input voltage.
  2. Output Voltage (VOUT):

    • The output voltage can be adjusted from 1.2V to 35V using external resistors.
    • Use the formula: ( V_ = V_ left(1 + fracright) ), where ( V_ = 1.24V ).
  3. Output Current (IOUT):

    • The maximum output current is 1.5A. Ensure the load does not exceed this limit to avoid overheating or damage.
  4. Quiescent Current (IQ):

    • The quiescent current is typically 80μA at 5V input and 5V output. This is important for low-power applications.
  5. Dropout Voltage (VD):

    • The dropout voltage is typically 0.7V at 150mA output current. Ensure the input voltage is at least 0.7V higher than the desired output voltage.
  6. Reference Voltage (VREF):

    • The internal reference voltage is 1.24V, which is used for setting the output voltage.
  7. Power Dissipation (PD):

    • The maximum power dissipation is 15W. Use adequate heatsinking if operating near this limit.
  8. Operating Temperature (TOPR):

    • The device can operate from -40°C to 125°C. Ensure proper cooling in high-temperature environments.
  9. Storage Temperature (TSTG):

    • Store the device between -65°C and 150°C.
  10. Capacitor Selection:

    • Use ceramic capacitors for high-frequency bypassing and electrolytic capacitors for bulk capacitance.
    • Typical values for input and output capacitors are 10μF and 100nF, respectively.
  11. PCB Layout:

    • Place the input and output capacitors as close as possible to the IC to minimize parasitic inductance.
    • Ensure good thermal management by providing a large copper area or heatsink.
  12. Protection:

    • Consider adding reverse polarity protection and overvoltage protection circuits to safeguard the IC and connected components.
(For reference only)

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