Specifications
SKU: 11651625
Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
Input Voltage | VIN | 2.5 | 40 | V | ||
Output Voltage | VOUT | 1.2 | 35 | V | ||
Output Current | IOUT | 1.5 | A | |||
Quiescent Current | IQ | VIN = 5V, VOUT = 5V | 80 | μA | ||
Dropout Voltage | VD | IOUT = 150mA | 0.7 | V | ||
Reference Voltage | VREF | 1.24 | V | |||
Power Dissipation | PD | 15 | W | |||
Operating Temperature | TOPR | -40 | 125 | °C | ||
Storage Temperature | TSTG | -65 | 150 | °C |
Instructions for Using L4936
Input Voltage (VIN):
- Ensure the input voltage is within the range of 2.5V to 40V.
- Use appropriate filtering capacitors (e.g., 10μF) to stabilize the input voltage.
Output Voltage (VOUT):
- The output voltage can be adjusted from 1.2V to 35V using external resistors.
- Use the formula: ( V_ = V_ left(1 + fracright) ), where ( V_ = 1.24V ).
Output Current (IOUT):
- The maximum output current is 1.5A. Ensure the load does not exceed this limit to avoid overheating or damage.
Quiescent Current (IQ):
- The quiescent current is typically 80μA at 5V input and 5V output. This is important for low-power applications.
Dropout Voltage (VD):
- The dropout voltage is typically 0.7V at 150mA output current. Ensure the input voltage is at least 0.7V higher than the desired output voltage.
Reference Voltage (VREF):
- The internal reference voltage is 1.24V, which is used for setting the output voltage.
Power Dissipation (PD):
- The maximum power dissipation is 15W. Use adequate heatsinking if operating near this limit.
Operating Temperature (TOPR):
- The device can operate from -40°C to 125°C. Ensure proper cooling in high-temperature environments.
Storage Temperature (TSTG):
- Store the device between -65°C and 150°C.
Capacitor Selection:
- Use ceramic capacitors for high-frequency bypassing and electrolytic capacitors for bulk capacitance.
- Typical values for input and output capacitors are 10μF and 100nF, respectively.
PCB Layout:
- Place the input and output capacitors as close as possible to the IC to minimize parasitic inductance.
- Ensure good thermal management by providing a large copper area or heatsink.
Protection:
- Consider adding reverse polarity protection and overvoltage protection circuits to safeguard the IC and connected components.
Inquiry - L4936