Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the range of 2.7V to 3.6V.
   • Connect the Vcc pin to the power supply and GND pin to ground.

2. Current Consumption:

   • The device has a standby current of 1 μA to 5 μA and an active current of 10 mA to 25 mA. Design the power management circuitry to handle these currents.

3. Timing Parameters:

   • Access Time (tACC): The device requires a minimum of 70 ns to access data.
   • Write Cycle Time (tWC): A write operation takes at least 10 μs.
   • Block Erase Time (tBERS): Erasing a block takes approximately 200 ms.
   • Chip Erase Time (tCERS): Erasing the entire chip takes about 100 seconds.

4. Temperature:

   • Operate the device within the temperature range of -40°C to 85°C.
   • Store the device between -65°C and 150°C.

5. Data Retention:

   • The device retains data for up to 10 years under normal operating conditions.

6. Package:

   • The device comes in a TSOP-48 package. Ensure the PCB layout and soldering process are compatible with this package type.

7. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits.
   • Follow the recommended soldering profile to ensure reliable bonding and avoid thermal stress.

8. Programming:

   • Refer to the device datasheet for specific programming commands and sequences for read, write, and erase operations.

9. Testing:

   • Perform functional tests after assembly to verify proper operation and data integrity.

10. Compliance:

    • Ensure that the design complies with relevant standards and regulations for the intended application.