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LM2841XMK-ADJL/NOPB

Specifications

SKU: 11657003

BUY LM2841XMK-ADJL/NOPB https://www.utsource.net/itm/p/11657003.html

Parameter Description Min Typical Max Unit
Input Voltage (VIN) Operating input voltage range 4.5 - 60 V
Output Voltage (VOUT) Adjustable output voltage range 0.8 - 59.5 V
Output Current (IOUT) Continuous output current - 3 3.5 A
Switching Frequency (fSW) Fixed switching frequency 500 - 500 kHz
Efficiency (η) Typical efficiency at nominal conditions - 92 - %
Dropout Voltage (VDROP) Minimum input-to-output voltage difference for regulation 1.2 - - V
Quiescent Current (IQ) Supply current during operation 0.5 - 1.5 mA
Shutdown Current (ISD) Supply current in shutdown mode - 0.1 - μA
Thermal Shutdown Temperature (TSD) Temperature at which the device shuts down to prevent damage - 160 - °C
Operating Junction Temperature (TJ) Range of operating junction temperatures -40 - 125 °C
Storage Temperature (TS) Range of storage temperatures -65 - 150 °C
Package Physical package type - SOIC-8 - -

Instructions for Use:

  1. Input Connection:

    • Connect the input voltage (VIN) to the VIN pin.
    • Ensure the input voltage is within the specified range (4.5V to 60V).
  2. Output Configuration:

    • Set the output voltage (VOUT) using external resistors connected to the FB (Feedback) pin.
    • The output voltage can be adjusted from 0.8V to 59.5V.
  3. Output Capacitor:

    • Use a suitable output capacitor (typically 10μF to 100μF) to stabilize the output voltage.
    • Place the capacitor close to the output pins to minimize inductive effects.
  4. Inductor Selection:

    • Choose an inductor with a value that matches the desired output current and switching frequency.
    • A typical inductor value is 10μH to 47μH.
  5. Thermal Management:

    • Ensure adequate heat dissipation by providing a heat sink or using a PCB with good thermal conductivity.
    • Monitor the junction temperature to ensure it stays within the operating range (-40°C to 125°C).
  6. Shutdown Function:

    • To enable the shutdown function, connect the SHDN pin to ground or a low logic level.
    • The shutdown current is typically 0.1μA.
  7. Protection Features:

    • The device includes overcurrent protection, thermal shutdown, and undervoltage lockout (UVLO) to protect against faults.
    • Ensure these features are understood and utilized as needed.
  8. Layout Considerations:

    • Keep high-current paths short and wide to minimize voltage drops and inductance.
    • Use ground planes to improve thermal performance and reduce noise.
  9. Testing and Validation:

    • Test the circuit under various load conditions to ensure stable operation.
    • Verify the output voltage and current meet the design specifications.
  10. Storage and Handling:

    • Store the device in a dry, cool environment to avoid moisture damage.
    • Handle with care to prevent static discharge and physical damage.

For detailed application notes and further information, refer to the datasheet provided by the manufacturer.

(For reference only)

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