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STR3123

Specifications

SKU: 11665117

BUY STR3123 https://www.utsource.net/itm/p/11665117.html

Parameter Symbol Min Typical Max Unit Conditions
Input Voltage V_IN 2.7 - 5.5 V
Output Voltage V_OUT - 3.3 - V Adjustable
Output Current I_OUT - 1.2 1.5 A
Quiescent Current I_Q - 100 - μA No Load
Dropout Voltage V_DROPOUT - 200 - mV I_OUT = 1.2A, V_IN = 3.3V
Efficiency η - 90 - % I_OUT = 1.2A, V_IN = 5V
Operating Temperature T_OP -40 - 85 °C
Storage Temperature T_STG -65 - 150 °C

Instructions for STR3123

  1. Input Connection:

    • Connect the input voltage (V_IN) to the IN pin.
    • Ensure the input voltage is within the range of 2.7V to 5.5V.
  2. Output Connection:

    • Connect the output load to the OUT pin.
    • The output voltage can be adjusted by using external resistors if required.
  3. Ground Connection:

    • Connect the ground (GND) pin to the common ground of the system.
  4. Capacitors:

    • Place a 1μF ceramic capacitor between the IN pin and GND as close to the device as possible.
    • Place a 10μF electrolytic capacitor between the OUT pin and GND to stabilize the output.
  5. Thermal Considerations:

    • Ensure adequate heat dissipation if operating at high output currents.
    • Use a heatsink if necessary, especially when the ambient temperature is high.
  6. Adjusting Output Voltage:

    • The output voltage can be adjusted using the following formula: [ V_ = 1.25 left(1 + fracright) ]
    • Where ( R_1 ) and ( R_2 ) are the resistors connected between the ADJ pin, GND, and OUT.
  7. Enabling/Disabling:

    • The EN pin can be used to enable or disable the regulator.
    • Apply a high logic level to the EN pin to enable the regulator.
    • Apply a low logic level to the EN pin to disable the regulator.
  8. Protection Features:

    • The device includes overcurrent protection and thermal shutdown to prevent damage under fault conditions.
  9. Storage and Handling:

    • Store the device in a dry, cool place.
    • Handle with care to avoid static discharge, which can damage the device.
  10. Mounting:

    • Solder the device to the PCB using standard surface mount technology (SMT) processes.
    • Ensure all connections are secure and free from solder bridges.

For detailed application circuits and further information, refer to the datasheet provided by the manufacturer.

(For reference only)

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