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MC145157P2

Specifications

SKU: 11674052

BUY MC145157P2 https://www.utsource.net/itm/p/11674052.html

Parameter Description Min Typ Max Unit
Supply Voltage (VCC) Operating supply voltage range 4.5 - 5.5 V
Output Current (IO) Maximum output current per pin - - 25 mA
Operating Temperature (TA) Ambient temperature range -40 - 85 °C
Storage Temperature (TSTG) Storage temperature range -65 - 150 °C
Input Voltage (VI) Input voltage range 0 - VCC V
Output Voltage (VO) Output voltage range (for logic levels) 0.4 - VCC - 0.4 V
Propagation Delay Time (tPD) Propagation delay time from input to output - 10 - ns
Power Dissipation (PD) Maximum power dissipation - - 340 mW
Quiescent Current (IQ) Supply current with all outputs high - 10 - μA

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the specified range of 4.5V to 5.5V.
    • Connect the ground (GND) pin to a stable ground reference.
  2. Input Signals:

    • Input voltages (VI) should be within the range of 0V to VCC.
    • Avoid applying voltages outside this range to prevent damage to the device.
  3. Output Handling:

    • The maximum output current (IO) per pin is 25mA. Do not exceed this limit to avoid overheating or damaging the device.
    • The output voltage (VO) will be between 0.4V and VCC - 0.4V for logic levels.
  4. Temperature Considerations:

    • Operate the device within the ambient temperature range of -40°C to 85°C.
    • Store the device in an environment with temperatures between -65°C and 150°C.
  5. Propagation Delay:

    • The typical propagation delay time (tPD) is 10ns. This is the time it takes for a change at the input to appear at the output.
  6. Power Dissipation:

    • The maximum power dissipation (PD) is 340mW. Ensure proper heat dissipation if the device is operating near this limit.
  7. Quiescent Current:

    • The quiescent current (IQ) is typically 10μA when all outputs are high. This is the current drawn by the device under no load conditions.
  8. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow standard ESD (Electrostatic Discharge) precautions during handling and assembly.
  9. Mounting and Soldering:

    • Follow recommended soldering profiles to ensure reliable connections without damaging the device.
    • Use appropriate soldering tools and techniques to avoid excessive heat exposure.
(For reference only)

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