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NCP1587ADR2G

Specifications

SKU: 11675243

BUY NCP1587ADR2G https://www.utsource.net/itm/p/11675243.html

Parameter Symbol Min Typical Max Unit
Input Voltage VIN 4.5 - 40 V
Output Voltage VOUT 0.9 - 12 V
Output Current IOUT - 2 3 A
Quiescent Current IQ - 65 - μA
Shutdown Current ISD - 1 - μA
Switching Frequency fSW 200 600 2000 kHz
Efficiency (Typical) η - 92 - %
Dropout Voltage VDROPOUT - 300 - mV
Thermal Shutdown Temperature TSD - 160 - °C
Operating Temperature TOPR -40 - 125 °C
Storage Temperature TSTG -65 - 150 °C

Instructions for NCP1587ADR2G

  1. Input Voltage (VIN):

    • Ensure the input voltage is within the range of 4.5V to 40V.
    • Use appropriate input capacitors to stabilize the input voltage.
  2. Output Voltage (VOUT):

    • Set the output voltage using external resistors according to the formula provided in the datasheet.
    • Use a low ESR output capacitor to filter the output and ensure stability.
  3. Output Current (IOUT):

    • The device can deliver up to 3A, but typical operation is at 2A.
    • Ensure proper heat dissipation if operating at higher currents.
  4. Quiescent Current (IQ):

    • The quiescent current is typically 65μA, which helps in maintaining high efficiency even at low loads.
  5. Shutdown Current (ISD):

    • When the shutdown pin is pulled low, the device enters a low-power mode with a shutdown current of approximately 1μA.
  6. Switching Frequency (fSW):

    • The switching frequency can be adjusted between 200kHz and 2000kHz using an external resistor.
    • Higher frequencies reduce the size of external components but may increase switching losses.
  7. Efficiency (η):

    • The typical efficiency is 92%, which can be optimized by selecting appropriate inductors and output capacitors.
  8. Dropout Voltage (VDROPOUT):

    • The dropout voltage is typically 300mV, allowing the device to operate efficiently even when the input voltage is close to the output voltage.
  9. Thermal Shutdown Temperature (TSD):

    • The device will shut down if the junction temperature exceeds 160°C to prevent damage.
  10. Operating Temperature (TOPR):

    • The device is designed to operate over a wide temperature range from -40°C to 125°C.
  11. Storage Temperature (TSTG):

    • Store the device in a dry environment with temperatures ranging from -65°C to 150°C.
  12. PCB Layout:

    • Follow the recommended PCB layout guidelines to minimize parasitic effects and ensure optimal performance.
    • Place the input and output capacitors as close as possible to the device to reduce noise and improve stability.
  13. Protection Features:

    • The device includes overcurrent protection, thermal shutdown, and undervoltage lockout to protect against various fault conditions.
  14. Application Notes:

    • Refer to the application notes and datasheet for detailed design considerations, including component selection and layout recommendations.
(For reference only)

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