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CD4072BNSR

Specifications

SKU: 11689647

BUY CD4072BNSR https://www.utsource.net/itm/p/11689647.html

Parameter Symbol Min Typ Max Unit Conditions
Supply Voltage VDD 3 - 18 V -
Input Low Voltage VIL - - 5 V VDD = 5V
Input High Voltage VIH 5 - 18 V VDD = 18V
Output Low Voltage VOL 0 0.1 0.4 V IOL = 4mA, VDD = 5V
Output High Voltage VOH 4.5 - 18 V IOH = -0.4mA, VDD = 18V
Input Current IIN -1 0 1 μA VDD = 5V to 18V
Output Current (Low) IOL - - -4 mA VDD = 5V
Output Current (High) IOH - - -0.4 mA VDD = 18V
Propagation Delay Time tpd - 12 35 ns VDD = 5V, TA = 25°C
Power Dissipation PD - - 100 mW Package Limit
Operating Temperature TA -40 - 85 °C -
Storage Temperature TSTG -65 - 150 °C -

Instructions for Use:

  1. Supply Voltage (VDD):

    • Ensure the supply voltage is within the range of 3V to 18V.
    • Avoid exceeding the maximum voltage to prevent damage to the device.
  2. Input Voltages:

    • For proper operation, input low voltages should be below 5V when VDD is 5V.
    • Input high voltages should be above 5V when VDD is 18V.
  3. Output Voltages:

    • When the output is low, ensure the voltage does not exceed 0.4V at 4mA load current.
    • When the output is high, ensure the voltage is at least 4.5V at -0.4mA load current.
  4. Current Ratings:

    • The input current should be kept between -1μA and 1μA.
    • The output can sink up to 4mA and source up to 0.4mA.
  5. Propagation Delay:

    • The typical propagation delay time is 12ns at 5V supply voltage and 25°C ambient temperature.
  6. Power Dissipation:

    • The device should not dissipate more than 100mW to avoid overheating.
  7. Temperature Ranges:

    • The operating temperature range is from -40°C to 85°C.
    • The storage temperature range is from -65°C to 150°C.
  8. Handling:

    • Handle the device with care to avoid static damage.
    • Follow standard ESD (Electrostatic Discharge) precautions during handling and installation.
  9. Mounting:

    • Ensure proper mounting and soldering to avoid mechanical stress on the package.
    • Use appropriate heat sinks if necessary to manage power dissipation.
  10. Testing:

    • Test the device under specified conditions to ensure it meets the performance parameters.
    • Use recommended test circuits and procedures for accurate results.
(For reference only)

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