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Specifications
SKU: 11708853
| Parameter | Symbol | Conditions | Min | Typical | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | VDD | -0.3 | 25 | V | ||
| Input Signal Voltage | VIN | -0.3 | 25 | V | ||
| Leakage Current | IL | VDD = 15V, VOUT = 0V | -0.1 | 0.1 | μA | |
| On-State Resistance | RON | VDD = 15V, VOUT = 0V | 120 | 200 | Ω | |
| Off-State Resistance | ROFF | VDD = 15V, VOUT = 0V | 10^9 | Ω | ||
| Switching Time (On/Off) | tSW | VDD = 15V | 0.1 | 0.5 | μs | |
| Power Dissipation | PD | 300 | mW | |||
| Operating Temperature | Toper | -40 | 85 | °C | ||
| Storage Temperature | Tstg | -65 | 150 | °C |
Instructions for Use:
Supply Voltage (VDD):
- Ensure the supply voltage is within the range of -0.3V to 25V.
- Avoid exceeding the maximum voltage to prevent damage to the device.
Input Signal Voltage (VIN):
- The input signal voltage should also be within the range of -0.3V to 25V to avoid damaging the device.
Leakage Current (IL):
- The leakage current is typically very low, ranging from -0.1μA to 0.1μA at VDD = 15V and VOUT = 0V. Ensure that any circuit design accounts for this minimal leakage.
On-State Resistance (RON):
- The on-state resistance is between 120Ω and 200Ω at VDD = 15V and VOUT = 0V. This value can affect the performance of the circuit, so it should be considered when designing the load.
Off-State Resistance (ROFF):
- The off-state resistance is extremely high, typically 10^9Ω at VDD = 15V and VOUT = 0V. This ensures minimal current flow when the switch is off.
Switching Time (tSW):
- The switching time from off to on or on to off is between 0.1μs and 0.5μs at VDD = 15V. This is important for applications requiring fast switching.
Power Dissipation (PD):
- The maximum power dissipation is 300mW. Ensure that the device is not subjected to conditions that would exceed this limit to avoid overheating and potential failure.
Operating Temperature (Toper):
- The operating temperature range is from -40°C to 85°C. Ensure that the device operates within this range to maintain reliability.
Storage Temperature (Tstg):
- The storage temperature range is from -65°C to 150°C. Store the device in a suitable environment to prevent damage during storage.
Handling:
- Handle the device with care to avoid static discharge, which can damage sensitive components. Use appropriate ESD protection measures.
Mounting:
- Follow recommended PCB layout guidelines to ensure proper thermal management and electrical performance. Ensure that the device is securely mounted to the PCB.
Testing:
- Before finalizing the design, perform thorough testing under various conditions to ensure the device meets the required specifications and performs reliably.
Inquiry - ADG408BR
