Specifications
SKU: 11712186
Parameter | Symbol | Min | Typ | Max | Unit | Description |
---|---|---|---|---|---|---|
Input Voltage | VIN | -0.3 | 65 | V | Maximum allowable input voltage | |
Continuous Current | ICONT | 28 | A | Continuous current at 25°C ambient temperature | ||
Peak Current | IPK | 56 | A | Peak current for 100 μs pulses | ||
RDS(on) | RDS(on) | 4.5 | 3.5 | 5 | mΩ | On-state resistance at 25°C, VGS = 10V |
Gate Charge | QG | 11 | nC | Total gate charge | ||
Reverse Recovery Time | trr | 70 | ns | Reverse recovery time | ||
Junction Temperature | TJ | -55 | 150 | °C | Operating junction temperature range | |
Storage Temperature | TSTG | -55 | 150 | °C | Storage temperature range |
Instructions for Use:
Input Voltage (VIN):
- Ensure the input voltage does not exceed 65V to avoid damaging the device.
- The minimum input voltage is -0.3V to prevent reverse bias issues.
Continuous Current (ICONT):
- The device can handle a continuous current of up to 28A at an ambient temperature of 25°C.
- For higher temperatures, derate the current according to the thermal resistance and heat dissipation capabilities.
Peak Current (IPK):
- The peak current should not exceed 56A for pulses of 100 μs duration.
- Ensure that the pulse width and frequency are within the safe operating area (SOA) of the device.
RDS(on) (On-State Resistance):
- The on-state resistance is typically 3.5 mΩ at 25°C with a gate-source voltage (VGS) of 10V.
- This value can vary between 4.5 mΩ and 5 mΩ depending on temperature and other conditions.
Gate Charge (QG):
- The total gate charge is 11 nC, which affects the switching speed and drive requirements.
- Ensure the gate driver can supply the necessary current to charge and discharge the gate quickly.
Reverse Recovery Time (trr):
- The reverse recovery time is 70 ns, which is important for high-frequency applications.
- Design the circuit to account for this time to avoid excessive power dissipation during switching.
Junction Temperature (TJ):
- The operating junction temperature range is from -55°C to 150°C.
- Monitor the junction temperature to ensure it stays within this range to prevent thermal damage.
Storage Temperature (TSTG):
- Store the device in an environment where the temperature ranges from -55°C to 150°C.
- Avoid exposing the device to extreme temperatures outside this range to prevent degradation.
Additional Notes:
- Always refer to the datasheet for more detailed information and specific application notes.
- Proper heat sinking and cooling mechanisms may be required for high-power applications to maintain the device within its safe operating limits.
Inquiry - 028N06NS