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MM2102AN-4L

Specifications

SKU: 11714133

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Parameter Description Value
Device Type High Speed CMOS Inverter with Schmitt Trigger -
Package Type SOP-8 -
Supply Voltage (Vcc) Operating Supply Voltage 4.5V to 5.5V
Input Voltage (VIH) High-Level Input Voltage ≥ 3.15V
Input Voltage (VIL) Low-Level Input Voltage ≤ 2.35V
Output Voltage (VOH) High-Level Output Voltage ≥ 4.75V
Output Voltage (VOL) Low-Level Output Voltage ≤ 0.25V
Input Current (IIH) High-Level Input Current ≤ 1 μA
Input Current (IIL) Low-Level Input Current ≤ 1 μA
Output Current (IOH) High-Level Output Current -4 mA
Output Current (IOL) Low-Level Output Current 16 mA
Propagation Delay Time tpd (High to Low, Low to High) 7 ns (max)
Operating Temperature Junction Temperature -40°C to 85°C
Storage Temperature Storage Temperature Range -65°C to 150°C
Power Dissipation Maximum Power Dissipation per Package 360 mW

Instructions for Use

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the specified range of 4.5V to 5.5V.
    • Connect Vcc to the positive power supply and GND to the ground.
  2. Input Signal:

    • Apply input signals that meet the high-level (VIH) and low-level (VIL) voltage requirements.
    • Keep the input current within the specified limits to avoid damage.
  3. Output Signal:

    • The output will switch between high (VOH) and low (VOL) levels based on the input signal.
    • Ensure the load connected to the output can handle the specified output currents (IOH and IOL).
  4. Propagation Delay:

    • Account for the propagation delay time (tpd) when designing timing-sensitive circuits.
  5. Temperature Considerations:

    • Operate the device within the specified operating temperature range to ensure reliable performance.
    • Store the device in the recommended storage temperature range to prevent damage.
  6. Handling:

    • Handle the device with care to avoid static discharge, which can damage the sensitive components.
    • Follow proper soldering techniques to ensure good electrical connections and avoid thermal damage.
  7. Mounting:

    • Mount the device on a PCB using the appropriate soldering profile for the SOP-8 package.
    • Ensure proper cooling if the device is expected to dissipate significant power.
  8. Testing:

    • Test the device under typical operating conditions to verify its functionality.
    • Use a multimeter or oscilloscope to measure input and output voltages and currents.
(For reference only)

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