Instructions for Use:

1. Mounting:

   • Ensure proper mounting to a heatsink to manage thermal dissipation effectively.
   • Use thermal paste between the device and the heatsink to improve heat transfer.

2. Electrical Connections:

   • Connect the anode and cathode terminals correctly to avoid reverse polarity, which can lead to device failure.
   • Use appropriate wire gauges to handle the rated current without excessive voltage drop or overheating.

3. Thermal Management:

   • Monitor the junction temperature to ensure it does not exceed 175°C.
   • If operating at high power levels, consider forced air cooling or liquid cooling solutions.

4. Pulsed Operation:

   • For pulsed applications, ensure that the peak current does not exceed 180 A and the pulse duration is less than 1 ms with a duty cycle of less than 1%.

5. Storage:

   • Store the device in a dry environment within the storage temperature range of -65°C to 150°C.
   • Avoid exposure to corrosive environments or excessive humidity.

6. Handling:

   • Handle the device with care to avoid mechanical damage.
   • Use anti-static precautions to prevent electrostatic discharge (ESD) damage.

7. Testing:

   • Perform initial testing under controlled conditions to verify performance and ensure all connections are secure.
   • Regularly inspect the device for signs of wear or damage during operation.

8. Compliance:

   • Ensure compliance with relevant safety and regulatory standards for your application.