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MC68230FN8

Specifications

SKU: 11718206

BUY MC68230FN8 https://www.utsource.net/itm/p/11718206.html

Parameter Description Min Typ Max Unit
Supply Voltage (Vcc) Operating supply voltage 4.75 5.0 5.25 V
Standby Current (Icc) Current consumption in standby mode - 10 20 μA
Active Current (Icc) Current consumption in active mode 10 30 50 mA
Operating Temperature (Tamb) Ambient operating temperature range -40 - 85 °C
Storage Temperature (Tstg) Storage temperature range -65 - 150 °C
Input Voltage (Vin) Maximum input voltage for digital inputs 0 - 5.5 V
Output Voltage (Vout) Maximum output voltage for digital outputs 0 - 5.5 V
Output Current (Iout) Maximum output current per pin - - 25 mA
Clock Frequency (fclk) Maximum clock frequency - - 10 MHz
Propagation Delay (tpd) Typical propagation delay 20 - 50 ns

Instructions for MC68230FN8

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the specified range of 4.75V to 5.25V.
    • Use a stable power source to avoid voltage fluctuations.
  2. Current Consumption:

    • In standby mode, the current consumption should not exceed 20 μA.
    • In active mode, the current consumption can be up to 50 mA.
  3. Temperature:

    • Operate the device within the ambient temperature range of -40°C to 85°C.
    • Store the device within the storage temperature range of -65°C to 150°C.
  4. Input and Output Voltages:

    • Digital inputs should not exceed 5.5V.
    • Digital outputs should not exceed 5.5V.
    • Ensure that the output current per pin does not exceed 25 mA.
  5. Clock Frequency:

    • The maximum clock frequency is 10 MHz.
    • Ensure that the clock signal is stable and within the specified frequency range.
  6. Propagation Delay:

    • The typical propagation delay is between 20 ns and 50 ns.
    • Account for this delay in your timing calculations and system design.
  7. Handling and Storage:

    • Handle the device with care to avoid static damage.
    • Store the device in a dry and cool environment to prevent degradation.
  8. Mounting and Soldering:

    • Follow the recommended soldering profile to ensure proper mounting.
    • Avoid excessive heat during soldering to prevent damage to the device.
  9. Testing and Validation:

    • Perform thorough testing under various conditions to ensure reliable operation.
    • Validate the performance against the specified parameters and application requirements.
(For reference only)

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