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AOTF10N90

Specifications

SKU: 11720730

BUY AOTF10N90 https://www.utsource.net/itm/p/11720730.html

Parameter Value Description
Part Number AOTF10N90 -
Type N-Channel MOSFET -
VDS (Max) 100V Maximum Drain-to-Source Voltage
VGS (Max) ±20V Maximum Gate-to-Source Voltage
RDS(on) (Typical) 90mΩ @ VGS = 10V On-State Resistance at Gate-to-Source Voltage of 10V
ID (Continuous) 33A @ TC = 25°C Continuous Drain Current at Case Temperature of 25°C
ID (Pulse) 100A @ TC = 25°C Pulse Drain Current at Case Temperature of 25°C
Power Dissipation 140W @ TC = 25°C Maximum Power Dissipation at Case Temperature of 25°C
Junction Temperature -55°C to +175°C Operating Junction Temperature Range
Storage Temperature -65°C to +150°C Storage Temperature Range
Package TO-220 Package Type
Mounting Through-Hole Mounting Type

Instructions for Use

  1. Handling Precautions:

    • Handle the AOTF10N90 with care to avoid damage to the leads and body.
    • Use proper ESD (Electrostatic Discharge) protection to prevent damage from static electricity.
  2. Soldering:

    • Preheat the device to 125°C before soldering.
    • Soldering temperature should not exceed 260°C.
    • Soldering time should not exceed 10 seconds per lead.
  3. Thermal Management:

    • Ensure adequate heat sinking to manage the power dissipation, especially when operating at high current levels.
    • The thermal resistance (RθJC) from junction to case is 1.5°C/W. Use this value to calculate the required heat sink.
  4. Biasing:

    • Apply the gate-to-source voltage (VGS) within the specified range to ensure reliable operation.
    • Avoid exceeding the maximum VGS rating to prevent damage to the device.
  5. Operating Conditions:

    • Ensure that the drain-to-source voltage (VDS) does not exceed the maximum rated value.
    • Operate the device within the specified temperature range to avoid thermal runaway and ensure long-term reliability.
  6. Testing:

    • Test the device under controlled conditions to verify its performance and ensure it meets the application requirements.
    • Use appropriate test equipment and follow safety guidelines during testing.
  7. Storage:

    • Store the device in a dry, cool place away from direct sunlight and sources of heat.
    • Keep the device in its original packaging until ready for use to protect against moisture and physical damage.
(For reference only)

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