Instructions:

1. Handling:

   • Handle with care to avoid damage.
   • Use appropriate ESD (Electrostatic Discharge) protection when handling.

2. Soldering:

   • Preheat the board to 120°C to 150°C.
   • Soldering temperature should not exceed 300°C.
   • Soldering time should be limited to 3 seconds per joint.
   • Allow the component to cool naturally after soldering.

3. Storage:

   • Store in a dry, cool place.
   • Avoid exposure to high humidity and extreme temperatures.

4. Mounting:

   • Ensure the board is clean and free of contaminants.
   • Place the component on the board according to the silkscreen markings.
   • Use a reflow soldering process for surface mount components.

5. Testing:

   • Test the resistance using a digital multimeter to ensure it meets the specified tolerance.
   • Check for any visual defects or damage before use.

6. Usage:

   • Do not exceed the operating voltage and power ratings.
   • Ensure the operating temperature is within the specified range.
   • Regularly inspect the component for signs of wear or damage during operation.