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LH52B256-70LL

Specifications

SKU: 11722298

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Parameter Description Value Unit
Device Type SRAM (Static Random Access Memory)
Memory Capacity Total memory capacity 256 Kbit
Organization Memory organization 32K x 8
Supply Voltage (Vcc) Operating supply voltage 4.5 to 5.5 V
Standby Current (Icc) Supply current in standby mode 10 μA
Active Current (Icc) Supply current in active mode 30 mA
Access Time (tAA) Access time from address valid to data valid 70 ns
Cycle Time (tCYC) Minimum cycle time 70 ns
Address Lines Number of address lines 15
Data Lines Number of data lines 8
Package Type Package type SOP-28
Operating Temperature Operating temperature range -40 to +85 °C
Storage Temperature Storage temperature range -55 to +125 °C
Pin Configuration Pin configuration diagram Refer to datasheet

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the specified range of 4.5V to 5.5V.
    • Connect the ground (GND) pin to a stable ground reference.
  2. Addressing:

    • Apply the desired address to the address lines (A0-A14) before the start of the access cycle.
    • Address lines must be stable during the access time (tAA).
  3. Data Input/Output:

    • Data is read from or written to the data lines (D0-D7).
    • For write operations, ensure the data lines are stable before the write enable (WE) signal is asserted.
    • For read operations, data will be available on the data lines after the access time (tAA).
  4. Control Signals:

    • Chip Select (CS): Low to enable the device, high to disable.
    • Write Enable (WE): Low to write data, high for read operations.
    • Output Enable (OE): Low to enable data output, high to disable.
  5. Timing:

    • Ensure all timing parameters, such as access time (tAA) and cycle time (tCYC), are met to avoid data corruption.
    • Refer to the timing diagrams in the datasheet for detailed timing requirements.
  6. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal circuitry.
    • Store the device in a controlled environment within the specified storage temperature range.
  7. Mounting:

    • Follow the recommended soldering and mounting procedures to ensure reliable operation.
    • Ensure proper cooling if the device is used in high-frequency or high-temperature applications.

For more detailed information, refer to the specific datasheet provided by the manufacturer.

(For reference only)

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