Specifications
SKU: 11722298
Parameter | Description | Value | Unit |
---|---|---|---|
Device Type | SRAM (Static Random Access Memory) | ||
Memory Capacity | Total memory capacity | 256 Kbit | |
Organization | Memory organization | 32K x 8 | |
Supply Voltage (Vcc) | Operating supply voltage | 4.5 to 5.5 | V |
Standby Current (Icc) | Supply current in standby mode | 10 | μA |
Active Current (Icc) | Supply current in active mode | 30 | mA |
Access Time (tAA) | Access time from address valid to data valid | 70 | ns |
Cycle Time (tCYC) | Minimum cycle time | 70 | ns |
Address Lines | Number of address lines | 15 | |
Data Lines | Number of data lines | 8 | |
Package Type | Package type | SOP-28 | |
Operating Temperature | Operating temperature range | -40 to +85 | °C |
Storage Temperature | Storage temperature range | -55 to +125 | °C |
Pin Configuration | Pin configuration diagram | Refer to datasheet |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (Vcc) is within the specified range of 4.5V to 5.5V.
- Connect the ground (GND) pin to a stable ground reference.
Addressing:
- Apply the desired address to the address lines (A0-A14) before the start of the access cycle.
- Address lines must be stable during the access time (tAA).
Data Input/Output:
- Data is read from or written to the data lines (D0-D7).
- For write operations, ensure the data lines are stable before the write enable (WE) signal is asserted.
- For read operations, data will be available on the data lines after the access time (tAA).
Control Signals:
- Chip Select (CS): Low to enable the device, high to disable.
- Write Enable (WE): Low to write data, high for read operations.
- Output Enable (OE): Low to enable data output, high to disable.
Timing:
- Ensure all timing parameters, such as access time (tAA) and cycle time (tCYC), are met to avoid data corruption.
- Refer to the timing diagrams in the datasheet for detailed timing requirements.
Handling:
- Handle the device with care to avoid static discharge, which can damage the internal circuitry.
- Store the device in a controlled environment within the specified storage temperature range.
Mounting:
- Follow the recommended soldering and mounting procedures to ensure reliable operation.
- Ensure proper cooling if the device is used in high-frequency or high-temperature applications.
For more detailed information, refer to the specific datasheet provided by the manufacturer.
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