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P80NF55

Specifications

SKU: 11724764

BUY P80NF55 https://www.utsource.net/itm/p/11724764.html

Parameter Symbol Min Typ Max Unit Description
Drain-Source Voltage VDS - - 550 V Maximum voltage between drain and source with the gate open.
Gate-Source Voltage VGS -15 - 20 V Maximum voltage between gate and source.
Continuous Drain Current ID - 80 - A Continuous current flowing from drain to source at TJ = 25°C.
Pulse Drain Current ID(p) - 160 - A Peak pulse current flowing from drain to source at TC = 25°C, tp = 10 μs.
Power Dissipation PTOT - - 340 W Total power dissipation at TC = 25°C.
Junction Temperature TJ - - 175 °C Maximum operating junction temperature.
Storage Temperature TSTG -55 - 150 °C Temperature range for storage and non-operating conditions.
Thermal Resistance RθJC - 0.5 - °C/W Junction-to-case thermal resistance.

Instructions for Use:

  1. Handling Precautions:

    • Handle the P80NF55 with care to avoid static discharge which can damage the device.
    • Use proper ESD (Electrostatic Discharge) protection equipment when handling the component.
  2. Mounting:

    • Ensure that the mounting surface is clean and flat to ensure good thermal contact.
    • Apply a thin layer of thermal compound between the device and the heat sink to improve thermal conductivity.
  3. Biasing:

    • Apply the gate-source voltage (VGS) within the specified limits to avoid damaging the gate oxide.
    • Ensure that the gate-source voltage is stable and free from excessive noise.
  4. Current Limiting:

    • Use appropriate current limiting resistors or circuits to prevent exceeding the maximum continuous drain current (ID).
    • For pulse applications, ensure that the pulse duration does not exceed the specified limits to avoid overheating.
  5. Thermal Management:

    • Monitor the junction temperature (TJ) to ensure it does not exceed the maximum operating temperature.
    • Use a heat sink with adequate cooling capacity to dissipate the power generated by the device.
  6. Storage:

    • Store the P80NF55 in a dry, cool place within the specified storage temperature range.
    • Avoid exposure to extreme temperatures and humidity to prevent degradation of the component.
  7. Testing:

    • Use a suitable test setup to verify the performance of the P80NF55 before integrating it into a circuit.
    • Follow the datasheet specifications for testing parameters and conditions.
(For reference only)

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