Specifications
SKU: 11729113
Parameter | Description | Min | Typ | Max | Unit |
---|---|---|---|---|---|
Input Voltage (VCC) | Operating voltage range for the IC | 2.7 | - | 5.5 | V |
Output Voltage (VOUT) | Adjustable output voltage range | 0.8 | - | 3.3 | V |
Output Current (IOUT) | Maximum continuous output current | - | 1.5 | 3.0 | A |
Quiescent Current (IQ) | Current consumed by the IC when active | - | 0.6 | - | mA |
Shutdown Current (ISD) | Current consumed by the IC in shutdown mode | - | 0.1 | - | μA |
Efficiency (η) | Power efficiency at typical load conditions | - | 90 | - | % |
Dropout Voltage (VDROP) | Minimum input-to-output voltage difference for regulation | - | 0.3 | - | V |
Load Regulation | Change in output voltage with load current | - | ±1 | - | % |
Line Regulation | Change in output voltage with input voltage | - | ±0.1 | - | % |
Ripple Rejection | Ability to reject input ripple | - | 70 | - | dB |
Operating Temperature (Toper) | Range of temperatures over which the IC can operate reliably | -40 | - | 85 | °C |
Storage Temperature (Tstg) | Range of temperatures over which the IC can be stored | -65 | - | 150 | °C |
Instructions for Using IT6604E/AX
Power Supply Connection:
- Connect the VCC pin to the power supply.
- Ensure the input voltage is within the specified range (2.7V to 5.5V).
Output Configuration:
- Use external resistors to set the desired output voltage. The formula for calculating the output voltage is: [ V_ = V_ left(1 + fracright) ] where ( V_ = 0.8V ), ( R_1 ) is the resistor connected between the FB pin and GND, and ( R_2 ) is the resistor connected between the FB pin and the output.
Capacitor Selection:
- Place a ceramic capacitor (10μF) close to the VCC pin to filter out noise.
- Use a ceramic capacitor (10μF) at the output to stabilize the output voltage.
Shutdown Function:
- To enable the shutdown function, connect the SHDN pin to GND or apply a low logic level.
- To activate the IC, apply a high logic level to the SHDN pin.
Thermal Management:
- Ensure adequate heat dissipation if operating at high currents. Consider using a heatsink if necessary.
PCB Layout:
- Keep the PCB layout compact and minimize trace lengths, especially for the power and ground connections.
- Use a ground plane to reduce noise and improve stability.
Testing:
- After assembly, test the output voltage and current to ensure it meets the design specifications.
- Verify the efficiency and thermal performance under expected operating conditions.
Storage:
- Store the IC in a dry, cool place away from direct sunlight and sources of heat.
- Follow ESD (Electrostatic Discharge) precautions to avoid damage to the IC.
By following these instructions, you can effectively use the IT6604E/AX in your application.
(For reference only)Inquiry - IT6604E/AX