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IT6604E/AX

Specifications

SKU: 11729113

BUY IT6604E/AX https://www.utsource.net/itm/p/11729113.html

Parameter Description Min Typ Max Unit
Input Voltage (VCC) Operating voltage range for the IC 2.7 - 5.5 V
Output Voltage (VOUT) Adjustable output voltage range 0.8 - 3.3 V
Output Current (IOUT) Maximum continuous output current - 1.5 3.0 A
Quiescent Current (IQ) Current consumed by the IC when active - 0.6 - mA
Shutdown Current (ISD) Current consumed by the IC in shutdown mode - 0.1 - μA
Efficiency (η) Power efficiency at typical load conditions - 90 - %
Dropout Voltage (VDROP) Minimum input-to-output voltage difference for regulation - 0.3 - V
Load Regulation Change in output voltage with load current - ±1 - %
Line Regulation Change in output voltage with input voltage - ±0.1 - %
Ripple Rejection Ability to reject input ripple - 70 - dB
Operating Temperature (Toper) Range of temperatures over which the IC can operate reliably -40 - 85 °C
Storage Temperature (Tstg) Range of temperatures over which the IC can be stored -65 - 150 °C

Instructions for Using IT6604E/AX

  1. Power Supply Connection:

    • Connect the VCC pin to the power supply.
    • Ensure the input voltage is within the specified range (2.7V to 5.5V).
  2. Output Configuration:

    • Use external resistors to set the desired output voltage. The formula for calculating the output voltage is: [ V_ = V_ left(1 + fracright) ] where ( V_ = 0.8V ), ( R_1 ) is the resistor connected between the FB pin and GND, and ( R_2 ) is the resistor connected between the FB pin and the output.
  3. Capacitor Selection:

    • Place a ceramic capacitor (10μF) close to the VCC pin to filter out noise.
    • Use a ceramic capacitor (10μF) at the output to stabilize the output voltage.
  4. Shutdown Function:

    • To enable the shutdown function, connect the SHDN pin to GND or apply a low logic level.
    • To activate the IC, apply a high logic level to the SHDN pin.
  5. Thermal Management:

    • Ensure adequate heat dissipation if operating at high currents. Consider using a heatsink if necessary.
  6. PCB Layout:

    • Keep the PCB layout compact and minimize trace lengths, especially for the power and ground connections.
    • Use a ground plane to reduce noise and improve stability.
  7. Testing:

    • After assembly, test the output voltage and current to ensure it meets the design specifications.
    • Verify the efficiency and thermal performance under expected operating conditions.
  8. Storage:

    • Store the IC in a dry, cool place away from direct sunlight and sources of heat.
    • Follow ESD (Electrostatic Discharge) precautions to avoid damage to the IC.

By following these instructions, you can effectively use the IT6604E/AX in your application.

(For reference only)

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