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2SK2312

Specifications

SKU: 11729716

BUY 2SK2312 https://www.utsource.net/itm/p/11729716.html

Parameter Symbol Value Unit
Drain-Source Voltage (Max) Vds(max) 500 V
Gate-Source Voltage (Max) Vgs(max) ±20 V
Continuous Drain Current (Tc=25°C) Id 20 A
Continuous Drain Current (Tc=100°C) Id 15 A
Pulse Drain Current (Tc=25°C, t=10ms) Idp 40 A
Transconductance (Min) Gfs(min) 12 S
Input Capacitance Ciss 2700 pF
Output Capacitance Coss 250 pF
Reverse Transfer Capacitance Crss 300 pF
Gate Threshold Voltage Vth 2 to 4 V
Total Power Dissipation (Tc=25°C) Ptot 200 W
Total Power Dissipation (Tc=100°C) Ptot 150 W
Junction Temperature (Max) Tj(max) 175 °C
Storage Temperature Range Tstg -55 to 175 °C

Instructions for Use:

  1. Mounting:

    • Ensure proper heat sinking to maintain the junction temperature within the specified range.
    • Use a thermal compound between the transistor and the heatsink to improve thermal conductivity.
  2. Biasing:

    • Apply the gate-source voltage (Vgs) carefully to avoid exceeding the maximum ratings.
    • Ensure that the gate is properly decoupled to prevent oscillations.
  3. Operation:

    • Operate the device within the continuous drain current limits for reliable performance.
    • For pulse applications, ensure that the pulse duration and frequency do not exceed the specified pulse drain current limits.
  4. Storage:

    • Store the device in a dry, cool environment to prevent moisture damage.
    • Handle with care to avoid mechanical stress or damage to the leads.
  5. Testing:

    • Use appropriate test equipment and procedures to avoid damaging the device during testing.
    • Verify all connections and settings before applying power.
  6. Safety:

    • Always follow standard safety practices when handling high-voltage and high-current circuits.
    • Use protective equipment as necessary.
(For reference only)

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