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TLP523-4

Specifications

SKU: 11729821

BUY TLP523-4 https://www.utsource.net/itm/p/11729821.html

Parameter Symbol Min Typ Max Unit
Forward Voltage (IF=10mA) VF 1.1 1.3 1.5 V
Forward Current (Continuous) IF - 50 - mA
Peak Forward Current (t=1ms) IFP - 100 - mA
Reverse Voltage VR - 5 - V
Output Collector-Emitter Saturation Voltage (IC=10mA, VCE=5V) VCE(sat) 0.2 0.3 0.4 V
Output Collector Current (VCE=5V) IC - 10 - mA
Isolation Voltage (Test Condition: 1min, IOT=1mA) VIORM - 2500 - V
Propagation Delay Time (VIN=5V, VOUT=5V, IF=10mA, IC=10mA) tPLH, tPHL - 1.5 - μs
Storage Temperature Tstg -40 - 105 °C
Operating Temperature Topr -40 - 85 °C

Instructions for Use:

  1. Forward Current (IF):

    • Ensure that the forward current through the LED does not exceed 50mA continuously.
    • For short pulses, the peak forward current can be up to 100mA for 1ms.
  2. Reverse Voltage (VR):

    • The device should not be subjected to reverse voltages exceeding 5V.
  3. Output Collector-Emitter Saturation Voltage (VCE(sat)):

    • When the output transistor is saturated (IC=10mA, VCE=5V), the collector-emitter voltage should be between 0.2V and 0.4V.
  4. Output Collector Current (IC):

    • The maximum continuous collector current should not exceed 10mA.
  5. Isolation Voltage (VIORM):

    • The device provides isolation up to 2500V for 1 minute under test conditions (IOT=1mA).
  6. Propagation Delay Time (tPLH, tPHL):

    • The typical propagation delay time is 1.5μs when the input and output voltages are 5V, and the forward and collector currents are 10mA each.
  7. Temperature Ranges:

    • Storage Temperature (Tstg): The device can be stored at temperatures ranging from -40°C to 105°C.
    • Operating Temperature (Topr): The device should operate within a temperature range of -40°C to 85°C.
  8. Handling Precautions:

    • Handle the device with care to avoid damage from electrostatic discharge (ESD).
    • Ensure proper heat sinking if the device is to be used in high-power applications.
  9. Mounting:

    • Follow the recommended PCB layout and soldering profiles to ensure reliable performance and prevent thermal issues.
  10. Testing:

    • Before using the device in a final application, perform thorough testing to verify its performance under actual operating conditions.
(For reference only)

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