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K5A60D

Specifications

SKU: 11731544

BUY K5A60D https://www.utsource.net/itm/p/11731544.html

Parameter Symbol Min Typical Max Unit Description
Supply Voltage VDD 1.7 - 3.6 V Operating supply voltage
Standby Current IDD - 0.1 1 μA Current consumption in standby mode
Active Current IDD - 2.5 5 mA Current consumption in active mode
Output Current IO 0.1 10 20 mA Maximum output current per pin
Operating Temp. Toper -40 - 85 °C Operating temperature range
Storage Temp. Tstg -65 - 150 °C Storage temperature range
Input Voltage VIN 0 - VDD V Input voltage range
Output Voltage VOUT 0 - VDD V Output voltage range
Rise Time tr - 10 20 ns Output rise time (20% to 80%)
Fall Time tf - 10 20 ns Output fall time (80% to 20%)
Propagation Delay tpd - 15 25 ns Propagation delay from input to output

Instructions for Using K5A60D

  1. Power Supply:

    • Ensure the supply voltage (VDD) is within the specified range of 1.7V to 3.6V.
    • Use a stable power source to avoid fluctuations that could affect performance.
  2. Current Consumption:

    • The device consumes a typical standby current of 0.1 μA and an active current of 2.5 mA. Design your circuit to manage these currents efficiently.
  3. Operating Temperature:

    • The operating temperature range is from -40°C to 85°C. Ensure the device is used within this range to prevent damage or malfunction.
  4. Storage Temperature:

    • Store the device in a temperature range of -65°C to 150°C to ensure long-term reliability.
  5. Input and Output Voltages:

    • The input voltage (VIN) should be between 0V and VDD, and the output voltage (VOUT) will also be between 0V and VDD. Avoid exceeding these limits to prevent damage.
  6. Timing Parameters:

    • The rise time (tr) and fall time (tf) are typically 10 ns with a maximum of 20 ns. The propagation delay (tpd) is typically 15 ns with a maximum of 25 ns. These parameters are crucial for timing-sensitive applications.
  7. Handling and Storage:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Store the device in a dry, cool place away from direct sunlight and extreme temperatures.
  8. Soldering:

    • Follow standard soldering practices to ensure proper connection without overheating the device. Use a temperature-controlled soldering iron and avoid excessive heat exposure.
  9. Testing:

    • Before integrating the device into a larger system, test it individually to ensure it meets the specified parameters and functions correctly.
  10. Application Notes:

    • Refer to the datasheet and application notes for detailed information on specific use cases and advanced configurations.
(For reference only)

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