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BA4580RFVM-TR

Specifications

SKU: 11732281

BUY BA4580RFVM-TR https://www.utsource.net/itm/p/11732281.html

Parameter Symbol Min Typical Max Unit Notes
Supply Voltage Vcc 4.5 - 5.5 V
Operating Temperature Ta -40 - 85 °C
Storage Temperature Tstg -65 - 150 °C
Output Current (Per Channel) Iout 0 20 30 mA
Input Voltage Range Vin 0 - 5.5 V
Output Voltage Range Vout 0 - 5.5 V
Quiescent Current Iq - 1.5 - μA
Shutdown Current Isd - 0.1 - μA
Propagation Delay Time tpd - 10 - ns
High-Level Input Voltage VIH 3.5 - 5.5 V
Low-Level Input Voltage VIL 0 - 1.5 V
High-Level Output Voltage VOH 4.5 - 5.5 V
Low-Level Output Voltage VOL 0 - 0.5 V

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the range of 4.5V to 5.5V.
    • Connect the Vcc pin to a stable power source.
  2. Temperature Considerations:

    • The device is designed to operate within an ambient temperature range of -40°C to 85°C.
    • Store the device in temperatures ranging from -65°C to 150°C.
  3. Output Current:

    • Each channel can source or sink up to 30mA, with a typical current of 20mA.
    • Do not exceed the maximum output current to avoid damage.
  4. Input and Output Voltages:

    • The input voltage (Vin) should be between 0V and 5.5V.
    • The output voltage (Vout) will match the input voltage within the specified limits.
  5. Quiescent and Shutdown Current:

    • The quiescent current (Iq) is typically 1.5μA.
    • In shutdown mode, the current (Isd) is typically 0.1μA.
  6. Propagation Delay:

    • The propagation delay time (tpd) is typically 10ns.
  7. Input Voltage Levels:

    • High-level input voltage (VIH) should be between 3.5V and 5.5V.
    • Low-level input voltage (VIL) should be between 0V and 1.5V.
  8. Output Voltage Levels:

    • High-level output voltage (VOH) will be between 4.5V and 5.5V.
    • Low-level output voltage (VOL) will be between 0V and 0.5V.
  9. Handling Precautions:

    • Handle the device with care to avoid static damage.
    • Follow proper soldering techniques to ensure reliable connections.
  10. Testing:

    • Before final assembly, test the device under typical operating conditions to ensure it meets the specified parameters.
(For reference only)

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