Specifications
SKU: 11732342
Parameter | Description | Value |
---|---|---|
Device Type | High-Speed CMOS Static RAM | 256K x 8 |
Supply Voltage (VCC) | Operating Range | 4.5V to 5.5V |
Access Time (tAC) | Maximum Access Time | 55ns |
Output Enable Time (tOE) | Minimum | 0ns |
Output Disable Time (tOH) | Minimum | 0ns |
Data Hold Time (tDH) | Minimum | -3ns |
Address Access Time (tAA) | Maximum | 55ns |
Chip Enable Time (tCE) | Minimum | 0ns |
Write Cycle Time (tCYW) | Minimum | 55ns |
Read Cycle Time (tCYR) | Minimum | 55ns |
Power Dissipation | Typical at VCC = 5V | 120mW |
Operating Temperature | Industrial Range | -40°C to +85°C |
Storage Temperature | Range | -65°C to +150°C |
Package Type | Shrink Small Outline Package (SSOP) | 28-Pin |
Mounting Type | Surface Mount Technology (SMT) | - |
Instructions for Use:
Power Supply:
- Ensure that the supply voltage (VCC) is within the specified range of 4.5V to 5.5V.
- Connect the ground (GND) pin to a stable ground reference.
Address Lines:
- Connect the address lines (A0-A17) to the appropriate address bus lines.
- Ensure that the address lines are stable before the access time (tAC) elapses.
Data Lines:
- Connect the data lines (DQ0-DQ7) to the data bus lines.
- Data should be held stable for at least the data hold time (tDH) after the rising edge of the clock.
Control Signals:
- Chip Enable (CE#): Active low. When CE# is high, the device is in standby mode.
- Output Enable (OE#): Active low. When OE# is low, the outputs are enabled.
- Write Enable (WE#): Active low. When WE# is low, the device is in write mode. When WE# is high, the device is in read mode.
Timing Considerations:
- Ensure that all timing parameters, such as access time (tAC), output enable time (tOE), and write cycle time (tCYW), are met to avoid data corruption or incorrect operation.
- Use appropriate pull-up or pull-down resistors on control lines if necessary.
Thermal Management:
- Ensure adequate cooling for the device, especially in high-density or high-temperature applications.
- Refer to the thermal resistance specifications for the package type to ensure proper heat dissipation.
Storage and Handling:
- Store the device in a dry, cool environment to prevent damage from moisture or extreme temperatures.
- Handle the device with care to avoid static discharge, which can damage the sensitive components.
Testing and Verification:
- Perform initial testing under controlled conditions to verify the correct operation of the device.
- Use a logic analyzer or oscilloscope to monitor signal integrity and timing parameters.
By following these instructions, you can ensure reliable and efficient operation of the AS6C62256-55SCN memory device.
(For reference only)Inquiry - AS6C62256-55SCN