Share:


AS6C62256-55SCN

Specifications

SKU: 11732342

BUY AS6C62256-55SCN https://www.utsource.net/itm/p/11732342.html

Parameter Description Value
Device Type High-Speed CMOS Static RAM 256K x 8
Supply Voltage (VCC) Operating Range 4.5V to 5.5V
Access Time (tAC) Maximum Access Time 55ns
Output Enable Time (tOE) Minimum 0ns
Output Disable Time (tOH) Minimum 0ns
Data Hold Time (tDH) Minimum -3ns
Address Access Time (tAA) Maximum 55ns
Chip Enable Time (tCE) Minimum 0ns
Write Cycle Time (tCYW) Minimum 55ns
Read Cycle Time (tCYR) Minimum 55ns
Power Dissipation Typical at VCC = 5V 120mW
Operating Temperature Industrial Range -40°C to +85°C
Storage Temperature Range -65°C to +150°C
Package Type Shrink Small Outline Package (SSOP) 28-Pin
Mounting Type Surface Mount Technology (SMT) -

Instructions for Use:

  1. Power Supply:

    • Ensure that the supply voltage (VCC) is within the specified range of 4.5V to 5.5V.
    • Connect the ground (GND) pin to a stable ground reference.
  2. Address Lines:

    • Connect the address lines (A0-A17) to the appropriate address bus lines.
    • Ensure that the address lines are stable before the access time (tAC) elapses.
  3. Data Lines:

    • Connect the data lines (DQ0-DQ7) to the data bus lines.
    • Data should be held stable for at least the data hold time (tDH) after the rising edge of the clock.
  4. Control Signals:

    • Chip Enable (CE#): Active low. When CE# is high, the device is in standby mode.
    • Output Enable (OE#): Active low. When OE# is low, the outputs are enabled.
    • Write Enable (WE#): Active low. When WE# is low, the device is in write mode. When WE# is high, the device is in read mode.
  5. Timing Considerations:

    • Ensure that all timing parameters, such as access time (tAC), output enable time (tOE), and write cycle time (tCYW), are met to avoid data corruption or incorrect operation.
    • Use appropriate pull-up or pull-down resistors on control lines if necessary.
  6. Thermal Management:

    • Ensure adequate cooling for the device, especially in high-density or high-temperature applications.
    • Refer to the thermal resistance specifications for the package type to ensure proper heat dissipation.
  7. Storage and Handling:

    • Store the device in a dry, cool environment to prevent damage from moisture or extreme temperatures.
    • Handle the device with care to avoid static discharge, which can damage the sensitive components.
  8. Testing and Verification:

    • Perform initial testing under controlled conditions to verify the correct operation of the device.
    • Use a logic analyzer or oscilloscope to monitor signal integrity and timing parameters.

By following these instructions, you can ensure reliable and efficient operation of the AS6C62256-55SCN memory device.

(For reference only)

 Inquiry - AS6C62256-55SCN