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MDF9N50B

Specifications

SKU: 11737999

BUY MDF9N50B https://www.utsource.net/itm/p/11737999.html

Parameter Symbol Min Typ Max Unit Description
Drain-Source Voltage VDS - 500 - V Maximum voltage that can be applied between drain and source with the gate shorted to the source.
Gate-Source Voltage VGS -15 - 15 V Maximum voltage that can be applied between gate and source.
Continuous Drain Current ID - 9 - A Maximum continuous current that can flow through the drain.
Pulse Drain Current IDpeak - 36 - A Maximum pulse current that can flow through the drain (tpulse = 10 ms, duty cycle = 1%).
Total Power Dissipation PTOT - - 125 W Maximum power dissipation at TC = 25°C.
Junction Temperature TJ - - 175 °C Maximum operating temperature of the junction.
Storage Temperature TSTG -55 - 150 °C Temperature range for storage and handling.

Instructions:

  1. Handling and Storage:

    • Store the MDF9N50B in a dry, cool place within the specified storage temperature range (-55°C to 150°C).
    • Handle the device with care to avoid mechanical stress or damage.
  2. Electrical Connections:

    • Ensure that the drain, source, and gate connections are properly soldered and securely attached.
    • Use appropriate heat sinks to manage the total power dissipation, especially when operating near the maximum power limit.
  3. Operating Conditions:

    • Do not exceed the maximum ratings for drain-source voltage (500V), gate-source voltage (±15V), continuous drain current (9A), and pulse drain current (36A).
    • Monitor the junction temperature to ensure it does not exceed 175°C.
  4. Pulse Operation:

    • When using the device in pulse mode, ensure that the pulse duration and duty cycle do not exceed the specified limits (tpulse = 10 ms, duty cycle = 1%).
  5. Thermal Management:

    • Use thermal management techniques such as heatsinks or cooling fans to maintain the junction temperature within safe limits, especially under high power conditions.
  6. Testing and Troubleshooting:

    • Regularly test the device parameters to ensure they remain within the specified limits.
    • If any parameter exceeds the maximum rating, investigate the cause and take corrective action to prevent damage to the device.
(For reference only)

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