Instructions:

1. Handling and Storage:

   • Store in a dry environment to prevent moisture damage.
   • Handle with care to avoid mechanical stress on the leads and body.

2. Mounting:

   • Ensure proper heat sinking to maintain junction temperature within safe limits.
   • Use a thermal compound between the device and the heat sink for better thermal conductivity.

3. Electrical Connections:

   • Apply gate-source voltage (V_GS) carefully to avoid exceeding the maximum ratings.
   • Ensure that the drain current (I_D) does not exceed the continuous or pulse ratings.

4. Operational Considerations:

   • Monitor the junction temperature (T_J) to prevent overheating.
   • Use appropriate derating factors for operation at higher ambient temperatures.

5. Safety:

   • Follow all safety guidelines for high-voltage and high-current applications.
   • Ensure proper insulation and grounding to prevent electrical hazards.

6. Testing:

   • Perform initial testing under controlled conditions to verify performance and reliability.
   • Regularly inspect the device for signs of wear or damage.

For detailed application notes and further information, refer to the datasheet provided by STMicroelectronics.