Share:


THS4031IDGNRG4

Specifications

SKU: 11738682

BUY THS4031IDGNRG4 https://www.utsource.net/itm/p/11738682.html

Parameter Symbol Min Typical Max Unit Notes
Supply Voltage VCC 2.7 - 5.25 V
Quiescent Current IQ - 2.6 - mA
Output Current (Source) IOUT(source) - 80 - mA
Output Current (Sink) IOUT(sink) - 80 - mA
Bandwidth BW - 200 - MHz
Slew Rate SR - 1000 - V/μs
Large Signal Voltage Gain AV - 1000 - V/V
Input Offset Voltage VOS - 0.6 - mV
Input Bias Current IB - 1 - nA
Input Capacitance CIN - 2.5 - pF
Output Impedance ZOUT - 10 - Ω
Common Mode Input Range VCM -0.3 - VCC + 0.3 V
Output Voltage Swing VOUT -0.3 - VCC - 0.3 V

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 2.7V to 5.25V.
    • Connect the power supply to the VCC pin and ground to the GND pin.
  2. Input Signal:

    • The input signal should be within the common mode input range, which is from -0.3V to VCC + 0.3V.
    • Connect the input signal to the non-inverting (IN+) and inverting (IN-) inputs.
  3. Output Signal:

    • The output voltage swing is from -0.3V to VCC - 0.3V.
    • Connect the load to the output (OUT) pin.
  4. Biasing and Decoupling:

    • Use decoupling capacitors (e.g., 0.1μF and 10μF) between VCC and GND to filter out noise and ensure stable operation.
    • Place these capacitors as close as possible to the device.
  5. Thermal Management:

    • Ensure adequate heat dissipation if the device is operating at high power levels or in high ambient temperatures.
    • Consider using a heatsink or thermal pad if necessary.
  6. Stability:

    • The THS4031 is designed to be stable with a wide range of capacitive loads. However, for optimal performance, keep the output capacitance below 100pF.
    • If using higher capacitances, consider adding a series resistor to the output to improve stability.
  7. PCB Layout:

    • Keep signal paths short and direct to minimize parasitic inductance and capacitance.
    • Use ground planes to reduce noise and improve signal integrity.
  8. Handling:

    • Handle the device with care to avoid static damage.
    • Follow proper ESD (Electrostatic Discharge) precautions when handling and soldering the device.
(For reference only)

 Inquiry - THS4031IDGNRG4