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EN5329QI

Specifications

SKU: 11739845

BUY EN5329QI https://www.utsource.net/itm/p/11739845.html

Parameter Description Min Typ Max Unit
Input Voltage (VIN) Operating input voltage range 4.5 - 5.5 V
Output Voltage (VOUT) Regulated output voltage - 3.3 - V
Output Current (IOUT) Continuous output current - 500 1000 mA
Quiescent Current (IQ) Supply current under no load - 50 100 μA
Dropout Voltage (VDROP) Voltage difference between VIN and VOUT at IOUT = 500mA - 200 300 mV
Load Regulation Change in VOUT with load current from 0 to 1000mA - 0.5 1.0 %
Line Regulation Change in VOUT with VIN from 4.5V to 5.5V - 0.1 0.2 %
Thermal Shutdown Temperature (TSD) Temperature at which the device shuts down to prevent damage - 150 170 °C
Storage Temperature Range (TSTG) Temperature range for storage -65 - 150 °C
Operating Junction Temperature (TJ) Maximum operating junction temperature -40 - 125 °C

Instructions for Use:

  1. Power Supply Connection:

    • Connect the input voltage (VIN) to the power supply within the specified range of 4.5V to 5.5V.
    • Ensure the output voltage (VOUT) is connected to the load requiring 3.3V.
  2. Capacitors:

    • Place a 10μF ceramic capacitor between VIN and GND close to the EN5329QI to stabilize the input voltage.
    • Place a 10μF ceramic capacitor between VOUT and GND to stabilize the output voltage.
  3. Thermal Management:

    • Ensure adequate heat dissipation by mounting the EN5329QI on a heatsink or a PCB with sufficient copper area.
    • Monitor the operating junction temperature (TJ) to ensure it does not exceed 125°C.
  4. Load Regulation:

    • The output voltage may vary slightly with changes in load current. Ensure the load regulation is within acceptable limits for your application.
  5. Line Regulation:

    • The output voltage may vary slightly with changes in input voltage. Ensure the line regulation is within acceptable limits for your application.
  6. Thermal Shutdown:

    • The device will automatically shut down if the junction temperature exceeds 150°C to prevent damage. Allow the device to cool before resuming operation.
  7. Storage:

    • Store the device in a dry environment within the temperature range of -65°C to 150°C.
  8. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal components. Use proper ESD protection practices.
(For reference only)

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