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TPS3307-33MDGNREP

Specifications

SKU: 11740219

BUY TPS3307-33MDGNREP https://www.utsource.net/itm/p/11740219.html

Parameter Symbol Min Typ Max Unit
Supply Voltage VDD 1.62 - 5.5 V
Input Voltage (High) VIH 0.8 - VDD V
Input Voltage (Low) VIL 0 - 0.4 V
Output Voltage (High) VOH - - VDD V
Output Voltage (Low) VOL 0 - 0.1 V
Quiescent Current IQ - 1.2 - μA
Response Time (Typical) tD - 100 - ns
Operating Temperature TOPR -40 - 125 °C

Instructions for Using TPS3307-33MDGNREP

  1. Supply Voltage:

    • Ensure the supply voltage (VDD) is within the range of 1.62V to 5.5V.
    • Use a stable power source to avoid fluctuations that could affect performance.
  2. Input Voltage Levels:

    • For a high input (VIH), the voltage should be at least 0.8V and can go up to the supply voltage (VDD).
    • For a low input (VIL), the voltage should be between 0V and 0.4V.
  3. Output Voltage Levels:

    • The output voltage (VOH) will be equal to the supply voltage (VDD) when the output is high.
    • The output voltage (VOL) will be no more than 0.1V when the output is low.
  4. Quiescent Current:

    • The typical quiescent current (IQ) is 1.2μA. This is the current consumed by the device when it is not switching.
  5. Response Time:

    • The typical response time (tD) is 100ns. This is the time it takes for the output to change state after a change in the input signal.
  6. Operating Temperature:

    • The device is designed to operate over a temperature range from -40°C to 125°C. Ensure that the ambient temperature does not exceed these limits to avoid damage or reduced performance.
  7. Handling and Storage:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Store the device in a dry, cool place away from direct sunlight and extreme temperatures.
  8. Mounting and Soldering:

    • Follow standard surface mount technology (SMT) procedures for mounting and soldering.
    • Use a temperature-controlled soldering iron and avoid excessive heat, which can damage the device.
  9. Testing:

    • Before integrating the device into a circuit, test it individually to ensure it meets the specified parameters.
    • Use appropriate test equipment and follow safety guidelines to prevent damage to the device or injury.
  10. Documentation:

    • Refer to the datasheet and application notes for detailed information on specific applications and advanced features.
    • Keep the datasheet accessible for quick reference during design and troubleshooting.
(For reference only)

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