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U2270B P/B

Specifications

SKU: 11745409

BUY U2270B P/B https://www.utsource.net/itm/p/11745409.html

Parameter Description Value
Device Type High-Performance Dual Op Amp U2270B
Package Package Type 8-Pin PDIP, SOIC
Supply Voltage Operating Supply Voltage Range 4.5V to 36V (Single)
Supply Current Quiescent Current per Amplifier 1.1mA (Typical)
Input Voltage Common Mode Input Voltage Range VSS - 1.5V to VDD - 1.5V
Output Voltage Output Voltage Swing VSS + 0.2V to VDD - 0.2V
Bandwidth Unity Gain Bandwidth 1MHz (Typical)
Slew Rate Slew Rate 0.5V/μs (Typical)
Gain Open-Loop Voltage Gain 100dB (Typical)
Input Bias Current Input Bias Current 50nA (Typical)
Input Offset Voltage Input Offset Voltage 2mV (Maximum)
Operating Temperature Operating Temperature Range -40°C to 125°C
Storage Temperature Storage Temperature Range -65°C to 150°C

Instructions for Use

  1. Power Supply Connection:

    • Connect the positive supply voltage (VDD) to Pin 8.
    • Connect the negative supply voltage (VSS) to Pin 4.
  2. Ground Connection:

    • Ensure a stable ground connection by connecting Pin 4 (VSS) to the system ground.
  3. Input Connection:

    • Connect the non-inverting input (Pin 3) and inverting input (Pin 2) for the first op-amp.
    • Connect the non-inverting input (Pin 6) and inverting input (Pin 5) for the second op-amp.
  4. Output Connection:

    • The output of the first op-amp is on Pin 1.
    • The output of the second op-amp is on Pin 7.
  5. Decoupling Capacitors:

    • Place decoupling capacitors (typically 0.1μF and 10μF) close to the power supply pins to reduce noise and ensure stability.
  6. Biasing and Feedback:

    • Properly bias the inputs and use feedback resistors to set the gain and stability of the op-amp circuits.
  7. Temperature Considerations:

    • Ensure that the device operates within the specified temperature range to avoid damage or performance degradation.
  8. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow proper soldering techniques to avoid thermal stress during assembly.
(For reference only)

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