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TD62004AF

Specifications

SKU: 11755037

BUY TD62004AF https://www.utsource.net/itm/p/11755037.html

Parameter Symbol Min Typical Max Unit Condition
Supply Voltage Vcc 1.8 - 5.5 V
Output Current (per pin) Iout - 50 100 mA Pulse, t = 1ms
Continuous Output Current Iout(C) - 30 - mA
Input Voltage Range Vin 0 - Vcc V
Operating Temperature Toper -40 - 85 °C
Storage Temperature Tstg -55 - 150 °C
Quiescent Current Iq - 20 - μA Vcc = 5V
Power Dissipation Pd - - 625 mW Ta = 25°C, PDIP-16
Thermal Resistance RθJA - 175 - °C/W PDIP-16

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the range of 1.8V to 5.5V.
    • Use appropriate decoupling capacitors (typically 0.1μF and 10μF) close to the Vcc and GND pins to stabilize the power supply.
  2. Output Current:

    • The maximum continuous output current per pin is 30mA. For pulse loads, up to 100mA can be sourced or sunk for short durations (t = 1ms).
    • Ensure that the total power dissipation does not exceed 625mW to avoid overheating.
  3. Input Voltage:

    • The input voltage range is from 0V to Vcc. Inputs should not exceed the supply voltage to prevent damage.
  4. Temperature:

    • The operating temperature range is from -40°C to 85°C. Store the device between -55°C and 150°C.
    • For extended operation at high temperatures, ensure adequate heat dissipation and consider derating the output current.
  5. Quiescent Current:

    • The quiescent current is typically 20μA at Vcc = 5V. This is the current consumed by the device when no load is applied to the outputs.
  6. Thermal Management:

    • The thermal resistance (RθJA) is 175°C/W for the PDIP-16 package. Ensure proper PCB layout and heatsinking if operating near the maximum power dissipation.
  7. Handling:

    • Handle the device with care to avoid static damage. Use ESD protection measures during assembly and testing.
  8. Mounting:

    • Follow the recommended PCB layout guidelines for optimal performance and reliability. Ensure proper soldering and avoid excessive heat during soldering.
  9. Testing:

    • Test the device under typical operating conditions to verify functionality. Use a multimeter to check for correct voltages and currents.
  10. Storage:

    • Store the device in a dry, cool place away from direct sunlight and sources of heat. Use anti-static packaging for long-term storage.
(For reference only)

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