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MIP2G4

Specifications

SKU: 11760654

BUY MIP2G4 https://www.utsource.net/itm/p/11760654.html

Parameter Description Value
Part Number Full part number MIP2G4
Type Component type Integrated Circuit
Function Function of the IC Power Management
Package Package type QFN-16
Operating Voltage (V) Supply voltage range 2.7 - 5.5 V
Operating Temperature (°C) Temperature range for operation -40 to 85
Quiescent Current (μA) Current consumed by the IC when active 20 μA
Output Current (mA) Maximum continuous output current 1000 mA
Efficiency (%) Efficiency at typical operating conditions Up to 95%
Protection Features Built-in protection features Overcurrent, Thermal
Input Capacitance (pF) Input capacitance 100 pF
Output Capacitance (pF) Output capacitance 220 pF
Footprint PCB footprint dimensions 3x3 mm
RoHS Compliance Compliance with RoHS standards Yes

Instructions for Use

  1. Power Supply Connection:

    • Connect the input power supply to the VIN pin.
    • Ensure the input voltage is within the specified range (2.7 - 5.5 V).
  2. Ground Connection:

    • Connect the GND pin to the system ground.
  3. Output Connection:

    • Connect the load to the VOUT pin.
    • Ensure the load current does not exceed the maximum output current (1000 mA).
  4. Capacitors:

    • Place a 100 pF capacitor between VIN and GND close to the IC.
    • Place a 220 pF capacitor between VOUT and GND close to the IC.
  5. Thermal Management:

    • Ensure adequate heat dissipation if operating near the maximum output current.
    • Use a heatsink or thermal pad if necessary.
  6. Protection:

    • The IC has built-in overcurrent and thermal protection.
    • In case of overcurrent, the IC will automatically shut down and restart after a cooldown period.
  7. PCB Layout:

    • Follow the recommended PCB layout guidelines to ensure optimal performance.
    • Keep traces short and wide to minimize inductance and resistance.
  8. Storage:

    • Store the IC in a dry, cool place to prevent moisture damage.
    • Handle with care to avoid static discharge.
  9. Testing:

    • Before final assembly, test the IC on a breadboard or evaluation board to ensure it meets the required specifications.
  10. Documentation:

    • Refer to the datasheet for detailed electrical characteristics and application notes.
    • Contact the manufacturer for any additional support or customization.
(For reference only)

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