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TC5563APL-10L

Specifications

SKU: 11772028

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Parameter Description Value Unit
Device Type 512K x 8-bit CMOS SRAM with Low Power Consumption - -
Supply Voltage (VCC) Operating Voltage Range 2.7 to 3.6 V
Standby Current (ISB) Current in Standby Mode 1.0 μA (max)
Active Current (ICC) Current in Active Mode 35 mA (max)
Access Time (tAA) Access Time from Address Latch to Data Valid 10 ns (max)
Data Hold Time (tDH) Minimum Data Hold Time after WE# Rising Edge 0 ns (min)
Output Enable Time (tOE) Output Enable Time 0 ns (min)
Write Enable Time (tWE) Write Enable Time 0 ns (min)
Package Type Package Style SOP (Small Outline Package) -
Pin Count Number of Pins 24 -
Operating Temperature Range Temperature Range for Normal Operation -40 to +85 °C
Storage Temperature Range Temperature Range for Storage -65 to +150 °C

Instructions:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 2.7V to 3.6V.
    • Connect the ground (GND) pin to a stable ground reference.
  2. Addressing:

    • Apply the desired address to the address lines (A0-A18) before the falling edge of the Write Enable (WE#) or Output Enable (OE#) signals.
  3. Data Input/Output:

    • For write operations, apply the data to the data lines (D0-D7) before the falling edge of the WE# signal.
    • For read operations, the data will be available on the data lines (D0-D7) after the access time (tAA).
  4. Control Signals:

    • Write Enable (WE#): Low to initiate a write operation.
    • Output Enable (OE#): Low to enable data output.
    • Chip Select (CS#): Low to select the device. If CS# is high, the device is in standby mode.
  5. Timing:

    • Ensure that all timing parameters, such as access time (tAA), data hold time (tDH), and output enable time (tOE), are met to avoid data corruption.
  6. Temperature:

    • Operate the device within the specified temperature range (-40°C to +85°C) for reliable performance.
    • Store the device within the storage temperature range (-65°C to +150°C).
  7. Handling:

    • Handle the device with care to avoid static damage. Use proper ESD protection measures.
  8. Mounting:

    • Follow the recommended PCB layout and soldering guidelines provided by the manufacturer to ensure reliable operation and prevent thermal issues.
(For reference only)

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