Specifications
SKU: 11772382
Parameter | Symbol | Min | Typical | Max | Unit | Description |
---|---|---|---|---|---|---|
Supply Voltage | VDD | 2.7 | - | 5.5 | V | Operating voltage range |
Output Current | IO | - | 100 | - | mA | Maximum output current per channel |
Standby Current | ISB | - | 10 | - | μA | Current consumption in standby mode |
Operating Temperature | TOPR | -40 | - | 85 | °C | Operating temperature range |
Storage Temperature | TSTG | -65 | - | 150 | °C | Storage temperature range |
Input Voltage Range | VIN | 0 | - | VDD | V | Input voltage range for logic inputs |
Output Low Voltage | VOL | - | 0.4 | 0.9 | V | Output low voltage at IO = 100 mA |
Output High Voltage | VOH | 2.4 | - | VDD | V | Output high voltage at IO = -100 mA |
Propagation Delay | tpd | - | 15 | - | ns | Propagation delay time (input to output) |
Power Dissipation | PD | - | - | 600 | mW | Maximum power dissipation per package |
Instructions:
Power Supply:
- Ensure the supply voltage (VDD) is within the specified range of 2.7V to 5.5V.
- Use a stable power source to avoid fluctuations that could affect performance.
Output Current:
- Do not exceed the maximum output current of 100 mA per channel to prevent damage to the device.
- If higher currents are required, consider using external drivers or transistors.
Standby Mode:
- The device consumes a very low current (10 μA typical) in standby mode, which can be useful for power-sensitive applications.
Temperature Considerations:
- Operate the device within the specified temperature range (-40°C to 85°C) to ensure reliable performance.
- Store the device in a temperature range between -65°C and 150°C.
Input Voltage:
- Logic inputs should be within the range of 0V to VDD to avoid damage or incorrect operation.
Output Levels:
- The output low voltage (VOL) should not exceed 0.9V at 100 mA output current.
- The output high voltage (VOH) should be at least 2.4V at -100 mA output current.
Propagation Delay:
- The typical propagation delay time (tpd) is 15 ns, which is important for timing considerations in digital circuits.
Power Dissipation:
- Ensure that the total power dissipation does not exceed 600 mW to avoid overheating and potential damage to the device.
- Use appropriate heat sinking if operating near the maximum power dissipation limit.
Handling:
- Handle the device with care to avoid static discharge, which can damage sensitive components.
- Follow standard ESD (Electrostatic Discharge) precautions when handling and installing the device.
Mounting:
- Ensure proper mounting on the PCB to maintain good thermal and electrical connections.
- Follow the recommended PCB layout guidelines provided by the manufacturer for optimal performance.
Inquiry - GT30F124