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GT30F124

Specifications

SKU: 11772382

BUY GT30F124 https://www.utsource.net/itm/p/11772382.html

Parameter Symbol Min Typical Max Unit Description
Supply Voltage VDD 2.7 - 5.5 V Operating voltage range
Output Current IO - 100 - mA Maximum output current per channel
Standby Current ISB - 10 - μA Current consumption in standby mode
Operating Temperature TOPR -40 - 85 °C Operating temperature range
Storage Temperature TSTG -65 - 150 °C Storage temperature range
Input Voltage Range VIN 0 - VDD V Input voltage range for logic inputs
Output Low Voltage VOL - 0.4 0.9 V Output low voltage at IO = 100 mA
Output High Voltage VOH 2.4 - VDD V Output high voltage at IO = -100 mA
Propagation Delay tpd - 15 - ns Propagation delay time (input to output)
Power Dissipation PD - - 600 mW Maximum power dissipation per package

Instructions:

  1. Power Supply:

    • Ensure the supply voltage (VDD) is within the specified range of 2.7V to 5.5V.
    • Use a stable power source to avoid fluctuations that could affect performance.
  2. Output Current:

    • Do not exceed the maximum output current of 100 mA per channel to prevent damage to the device.
    • If higher currents are required, consider using external drivers or transistors.
  3. Standby Mode:

    • The device consumes a very low current (10 μA typical) in standby mode, which can be useful for power-sensitive applications.
  4. Temperature Considerations:

    • Operate the device within the specified temperature range (-40°C to 85°C) to ensure reliable performance.
    • Store the device in a temperature range between -65°C and 150°C.
  5. Input Voltage:

    • Logic inputs should be within the range of 0V to VDD to avoid damage or incorrect operation.
  6. Output Levels:

    • The output low voltage (VOL) should not exceed 0.9V at 100 mA output current.
    • The output high voltage (VOH) should be at least 2.4V at -100 mA output current.
  7. Propagation Delay:

    • The typical propagation delay time (tpd) is 15 ns, which is important for timing considerations in digital circuits.
  8. Power Dissipation:

    • Ensure that the total power dissipation does not exceed 600 mW to avoid overheating and potential damage to the device.
    • Use appropriate heat sinking if operating near the maximum power dissipation limit.
  9. Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow standard ESD (Electrostatic Discharge) precautions when handling and installing the device.
  10. Mounting:

    • Ensure proper mounting on the PCB to maintain good thermal and electrical connections.
    • Follow the recommended PCB layout guidelines provided by the manufacturer for optimal performance.
(For reference only)

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