Instructions for Use:

1. Handling Precautions:

   • Handle with care to avoid damage to the leads and case.
   • Avoid exposing the device to excessive static electricity.

2. Mounting:

   • Ensure proper heat sinking to maintain the junction temperature within the specified range.
   • Use a thermal compound between the IGBT and the heatsink for better thermal conductivity.

3. Soldering:

   • Preheat the device to 125°C before soldering.
   • Soldering temperature should not exceed 260°C.
   • Soldering time should be kept to a minimum (less than 10 seconds).

4. Electrical Connections:

   • Connect the collector (C), gate (G), and emitter (E) terminals correctly.
   • Ensure that the gate-emitter voltage (Vge) does not exceed the maximum rating.
   • Use appropriate gate drive circuits to ensure reliable operation.

5. Storage:

   • Store in a dry, cool place away from direct sunlight and corrosive environments.
   • Keep the devices in their original packaging until ready for use.

6. Testing:

   • Use a multimeter or an IGBT tester to verify the functionality of the device.
   • Test the device under controlled conditions to avoid damage.

7. Disposal:

   • Dispose of the device according to local environmental regulations.

For more detailed information, refer to the datasheet provided by the manufacturer.