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MC74HC157AN

Specifications

SKU: 11775268

BUY MC74HC157AN https://www.utsource.net/itm/p/11775268.html

Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC Operating 2.0 - 6.0 V
Input Low Voltage VIL VCC = 4.5V to 5.5V 0.8 - - V
Input High Voltage VIH VCC = 4.5V to 5.5V - - 2.0 V
Output Low Voltage VOL IOL = 4 mA, VCC = 4.5V to 5.5V 0.1 - 0.2 V
Output High Voltage VOH IOH = -4 mA, VCC = 4.5V to 5.5V 4.4 - 4.5 V
Propagation Delay Time tpd VCC = 4.5V to 5.5V, TA = 25°C 6 - 12 ns
Power Dissipation PD Maximum - - 100 mW
Operating Temperature Range TA - -40 - 85 °C
Storage Temperature Range TSTG - -65 - 150 °C

Instructions for Using the MC74HC157AN

  1. Power Supply:

    • Ensure that the supply voltage (VCC) is within the operating range of 2.0V to 6.0V.
    • Connect VCC to the positive power supply and GND to the ground.
  2. Input Signals:

    • The input low voltage (VIL) should be no higher than 0.8V when VCC is between 4.5V and 5.5V.
    • The input high voltage (VIH) should be at least 2.0V under the same conditions.
  3. Output Signals:

    • When the output is low (VOL), it should not exceed 0.2V with a load current of 4 mA.
    • When the output is high (VOH), it should be at least 4.4V with a load current of -4 mA.
  4. Propagation Delay:

    • The propagation delay time (tpd) is the time it takes for the output to change after the input changes. It should be between 6 ns and 12 ns at room temperature (25°C) and with VCC between 4.5V and 5.5V.
  5. Power Dissipation:

    • The maximum power dissipation (PD) is 100 mW. Ensure that the device does not exceed this limit to avoid overheating and potential damage.
  6. Temperature Ranges:

    • The operating temperature range (TA) is from -40°C to 85°C.
    • The storage temperature range (TSTG) is from -65°C to 150°C. Store the device in a dry and cool place to prevent damage.
  7. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal circuits.
    • Use appropriate ESD (Electrostatic Discharge) protection measures during handling and installation.
  8. Pin Configuration:

    • Refer to the pinout diagram provided in the datasheet to correctly connect the device to your circuit.
  9. Testing:

    • Before integrating the device into a larger system, test it individually to ensure it meets the specified parameters and functions correctly.
  10. Compliance:

    • Ensure that the device complies with all relevant safety and regulatory standards for your application.
(For reference only)

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