Instructions for Handling and Assembly

1. Handling:

   • Use proper ESD (Electrostatic Discharge) protection equipment.
   • Handle by the edges; avoid touching the bottom or top surface.
   • Store in a dry environment to prevent moisture damage.

2. Mounting:

   • Ensure the PCB is clean and free from contaminants.
   • Apply a suitable amount of solder paste to the BGA pads.
   • Place the component using a pick-and-place machine.
   • Align the component accurately with the PCB pads.

3. Reflow Soldering:

   • Use a controlled reflow profile to ensure uniform heating.
   • Preheat the board to 150°C for 60-90 seconds.
   • Ramp up to the peak temperature of 230-250°C at a rate of 1-2°C/second.
   • Maintain the peak temperature for 10-20 seconds.
   • Cool down to below 100°C at a rate of 3-5°C/second.

4. Inspection:

   • Inspect the solder joints using X-ray or optical inspection methods.
   • Ensure all balls are properly soldered and there are no shorts or opens.

5. Testing:

   • Perform functional testing to verify the operation of the component.
   • Check the power supply and signal integrity.

6. Storage:

   • Store in a dry cabinet with desiccant to maintain low humidity.
   • Follow the recommended storage conditions to prevent damage.