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IRFB4310

Specifications

SKU: 12357895

BUY IRFB4310 https://www.utsource.net/itm/p/12357895.html

Parameter Symbol Test Conditions Min Typ Max Unit
Continuous Drain Current ID TC = 25°C - 18 - A
Pulse Drain Current IDpeak t = 10 μs, duty cycle = 1% - 67 - A
Gate-Source Voltage VGS - -20 - 12 V
Drain-Source Breakdown Voltage V(BR)DSS ID = 250 μA, IG = 0 - - 55 V
Gate-Threshold Voltage VGS(th) ID = 250 μA 2.0 4.0 6.0 V
On-State Resistance RDS(on) VGS = 10 V, ID = 18 A 6.0 - -
Total Gate Charge QG VGS = 10 V, VDS = 10 V, ID = 18 A - 148 - nC
Input Capacitance Ciss VGS = 0 V, f = 1 MHz - 2400 - pF
Output Capacitance Coss VDS = 15 V, f = 1 MHz - 490 - pF
Reverse Transfer Capacitance Crss VDS = 15 V, VGS = 0 V, f = 1 MHz - 190 - pF
Turn-On Delay Time td(on) VGS = 10 V, VDS = 30 V, ID = 18 A - 18 - ns
Rise Time tr VGS = 10 V, VDS = 30 V, ID = 18 A - 19 - ns
Turn-Off Delay Time td(off) VGS = 10 V, VDS = 30 V, ID = 18 A - 55 - ns
Fall Time tf VGS = 10 V, VDS = 30 V, ID = 18 A - 23 - ns

Instructions for Use:

  1. Mounting and Handling:

    • Handle the device with care to avoid mechanical damage.
    • Ensure proper heat sinking to manage thermal dissipation, especially during high current operations.
  2. Electrical Connections:

    • Connect the drain (D), source (S), and gate (G) terminals correctly.
    • Use short and direct connections to minimize parasitic inductances and resistances.
  3. Gate Drive:

    • Apply a gate-source voltage (VGS) within the specified range to ensure reliable operation.
    • Use a gate resistor to control the switching speed and reduce electromagnetic interference (EMI).
  4. Thermal Management:

    • Monitor the junction temperature (TJ) to ensure it does not exceed the maximum rating.
    • Use a heatsink or cooling system if necessary to maintain optimal operating temperatures.
  5. Overvoltage Protection:

    • Implement overvoltage protection circuits to prevent damage from transient voltages.
    • Consider using snubber circuits to suppress voltage spikes during switching.
  6. Storage and Transportation:

    • Store the device in a dry, cool environment to prevent moisture damage.
    • Follow ESD (Electrostatic Discharge) precautions to avoid damaging the device.
  7. Testing:

    • Perform initial testing under controlled conditions to verify proper operation.
    • Regularly inspect and test the device to ensure long-term reliability.
  8. Compliance:

    • Ensure that the application complies with relevant safety and regulatory standards.
(For reference only)

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