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Specifications
SKU: 12379136
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -55 | - | 55 | V | Maximum voltage between drain and source with gate open |
| Gate-Source Voltage | VGS | -10 | - | 10 | V | Maximum voltage between gate and source |
| Continuous Drain Current | ID | - | 2.8 | 3.2 | A | Continuous drain current at TA = 25°C |
| Pulse Drain Current | ID(pulse) | - | 7.0 | 9.0 | A | Pulse drain current (tp = 300 μs, fr ≤ 1 kHz) |
| Gate Charge | QG | - | 10 | 15 | nC | Total gate charge |
| Input Capacitance | Ciss | - | 650 | 900 | pF | Input capacitance |
| Output Capacitance | Coss | - | 170 | 230 | pF | Output capacitance |
| Reverse Transfer Capacitance | Crss | - | 120 | 160 | pF | Reverse transfer capacitance |
| RDS(on) @ VGS = 4.5V | RDS(on) | - | 0.07 | 0.10 | Ω | On-state resistance at VGS = 4.5V |
| RDS(on) @ VGS = 2.5V | RDS(on) | - | 0.10 | 0.15 | Ω | On-state resistance at VGS = 2.5V |
| Threshold Voltage | VGS(th) | 0.8 | 1.2 | 1.6 | V | Gate threshold voltage |
| Power Dissipation | PD | - | - | 1.5 | W | Maximum power dissipation at TA = 25°C |
| Junction Temperature | TJ | - | - | 150 | °C | Maximum junction temperature |
| Storage Temperature | TSTG | -55 | - | 150 | °C | Operating temperature range |
Instructions for Use
Mounting and Handling:
- Handle the device with care to avoid damage to the leads and body.
- Ensure that the device is mounted on a suitable heat sink if operating near its maximum power dissipation.
Electrical Connections:
- Connect the drain (D), source (S), and gate (G) terminals correctly to avoid damage.
- Use appropriate decoupling capacitors to stabilize the power supply and reduce noise.
Biasing:
- Apply the gate-source voltage (VGS) within the specified limits to ensure reliable operation.
- Ensure that the gate drive circuitry provides sufficient current to charge and discharge the gate capacitance quickly.
Thermal Management:
- Monitor the junction temperature (TJ) to ensure it does not exceed the maximum rating.
- Use thermal paste or thermal interface materials to improve heat transfer from the device to the heat sink.
Pulsed Operation:
- For pulsed applications, ensure that the pulse duration and frequency do not exceed the specified limits to avoid overheating.
Storage:
- Store the device in a dry, cool place away from direct sunlight and sources of heat.
- Protect the device from static electricity by using anti-static packaging and handling procedures.
Testing:
- Test the device under controlled conditions to verify its performance and reliability.
- Follow the recommended test procedures and conditions provided in the datasheet.
Safety:
- Always follow safe electrical practices when working with high voltages and currents.
- Use appropriate personal protective equipment (PPE) as needed.
Inquiry - SI2324A-TP
