Specifications
SKU: 12398995
Parameter | Description | Value |
---|---|---|
Device Type | High-Density, Low-Cost CPLD | XC95108 |
Package Type | Plastic Chip Carrier (PCC) | PC84 |
Number of I/Os | Number of Input/Output Pins | 84 |
Logic Cells | Number of Logic Cells | 108 |
Max. User Flash | Maximum User Flash Memory | 256 bits |
Operating Voltage | Supply Voltage Range | 3.3V ± 10% |
Operating Temperature | Industrial Temperature Range | -40°C to +85°C |
Max. Clock Frequency | Maximum Clock Frequency | 200 MHz |
Power Consumption | Typical Power Consumption at Max. Clock Frequency | 100 mW |
Package Size | Package Dimensions | 20 mm x 20 mm |
Pin Pitch | Pin Spacing | 0.8 mm |
Configuration Modes | Supported Configuration Modes | ISP, JTAG, ByteBlasterMV |
Programming Voltage | Voltage for Programming | 3.3V |
Configuration Time | Typical Configuration Time | 1 ms |
ESD Protection | Electrostatic Discharge Protection | HBM: 2000 V, MM: 200 V |
Instructions for XC95108-PC84
Power Supply:
- Ensure that the supply voltage is within the specified range of 3.3V ± 10%.
- Use appropriate decoupling capacitors (0.1 μF and 10 μF) close to the power pins to minimize noise.
Configuration:
- The device supports In-System Programming (ISP), Joint Test Action Group (JTAG), and ByteBlasterMV configuration modes.
- For ISP, connect the programming interface (e.g., JTAG) to the appropriate pins and use compatible software (e.g., iMPACT).
- Configuration time is typically 1 ms.
Clocking:
- The maximum clock frequency is 200 MHz. Ensure that the clock signal is clean and stable to avoid timing issues.
- Use a low-jitter clock source if high-frequency operation is required.
I/O Handling:
- All I/O pins are 3.3V tolerant. Ensure that input signals do not exceed the supply voltage.
- Use pull-up or pull-down resistors as needed to prevent floating inputs.
Thermal Management:
- The device operates within the industrial temperature range of -40°C to +85°C.
- Ensure adequate cooling if the device is expected to operate at high temperatures or in high-power applications.
ESD Protection:
- Handle the device with ESD precautions to avoid damage.
- The device has built-in ESD protection (HBM: 2000 V, MM: 200 V), but it is still important to follow proper handling procedures.
Testing and Verification:
- After configuration, verify the functionality using test vectors or boundary-scan testing.
- Use the JTAG interface for in-circuit testing and debugging.
Storage and Handling:
- Store the device in a dry environment to prevent moisture damage.
- Follow recommended storage and handling guidelines to ensure long-term reliability.
Inquiry - XC95108-PC84