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XC95108-PC84

Specifications

SKU: 12398995

BUY XC95108-PC84 https://www.utsource.net/itm/p/12398995.html

Parameter Description Value
Device Type High-Density, Low-Cost CPLD XC95108
Package Type Plastic Chip Carrier (PCC) PC84
Number of I/Os Number of Input/Output Pins 84
Logic Cells Number of Logic Cells 108
Max. User Flash Maximum User Flash Memory 256 bits
Operating Voltage Supply Voltage Range 3.3V ± 10%
Operating Temperature Industrial Temperature Range -40°C to +85°C
Max. Clock Frequency Maximum Clock Frequency 200 MHz
Power Consumption Typical Power Consumption at Max. Clock Frequency 100 mW
Package Size Package Dimensions 20 mm x 20 mm
Pin Pitch Pin Spacing 0.8 mm
Configuration Modes Supported Configuration Modes ISP, JTAG, ByteBlasterMV
Programming Voltage Voltage for Programming 3.3V
Configuration Time Typical Configuration Time 1 ms
ESD Protection Electrostatic Discharge Protection HBM: 2000 V, MM: 200 V

Instructions for XC95108-PC84

  1. Power Supply:

    • Ensure that the supply voltage is within the specified range of 3.3V ± 10%.
    • Use appropriate decoupling capacitors (0.1 μF and 10 μF) close to the power pins to minimize noise.
  2. Configuration:

    • The device supports In-System Programming (ISP), Joint Test Action Group (JTAG), and ByteBlasterMV configuration modes.
    • For ISP, connect the programming interface (e.g., JTAG) to the appropriate pins and use compatible software (e.g., iMPACT).
    • Configuration time is typically 1 ms.
  3. Clocking:

    • The maximum clock frequency is 200 MHz. Ensure that the clock signal is clean and stable to avoid timing issues.
    • Use a low-jitter clock source if high-frequency operation is required.
  4. I/O Handling:

    • All I/O pins are 3.3V tolerant. Ensure that input signals do not exceed the supply voltage.
    • Use pull-up or pull-down resistors as needed to prevent floating inputs.
  5. Thermal Management:

    • The device operates within the industrial temperature range of -40°C to +85°C.
    • Ensure adequate cooling if the device is expected to operate at high temperatures or in high-power applications.
  6. ESD Protection:

    • Handle the device with ESD precautions to avoid damage.
    • The device has built-in ESD protection (HBM: 2000 V, MM: 200 V), but it is still important to follow proper handling procedures.
  7. Testing and Verification:

    • After configuration, verify the functionality using test vectors or boundary-scan testing.
    • Use the JTAG interface for in-circuit testing and debugging.
  8. Storage and Handling:

    • Store the device in a dry environment to prevent moisture damage.
    • Follow recommended storage and handling guidelines to ensure long-term reliability.
(For reference only)

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