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W15NK90Z STW15NK90Z 15A 900V MOS

Specifications

SKU: 12399239

BUY W15NK90Z STW15NK90Z 15A 900V MOS https://www.utsource.net/itm/p/12399239.html

Parameter Symbol Min Typ Max Unit Notes
Drain-Source Voltage VDSS - 900 - V
Gate-Source Voltage VGSS -20 - 20 V
Continuous Drain Current ID - 15 - A @ TC = 25°C
Pulse Drain Current IDM - 30 - A @ TC = 25°C, tp = 10 ms, Duty Cycle = 1%
Power Dissipation PD - 160 - W @ TC = 25°C
Junction Temperature TJ - - 175 °C
Storage Temperature TSTG -55 - 150 °C
Thermal Resistance RθJC - 1.0 - °C/W Junction to Case
Input Capacitance Ciss - 1500 - pF @ VDS = 450V, VGS = 0V, f = 1 MHz
Output Capacitance Coss - 280 - pF @ VDS = 450V, VGS = 0V, f = 1 MHz
Gate Charge Qg - 65 - nC @ VDS = 450V, VGS = 10V, ID = 15A
Threshold Voltage VGS(th) 2.0 4.0 6.0 V @ ID = 250 μA
On-State Resistance RDS(on) - 1.2 - Ω @ VGS = 10V, ID = 15A

Instructions for Use:

  1. Handling Precautions:

    • The device is sensitive to electrostatic discharge (ESD). Use proper ESD protection measures during handling.
    • Avoid exceeding the maximum ratings specified in the table to prevent damage to the device.
  2. Mounting:

    • Ensure good thermal management by using a heatsink if necessary to keep the junction temperature within safe limits.
    • Follow the recommended PCB layout guidelines to minimize parasitic inductances and ensure reliable operation.
  3. Gate Drive:

    • Apply a gate-source voltage (VGS) within the specified range to turn the MOSFET on or off.
    • Use a gate resistor to control the switching speed and reduce electromagnetic interference (EMI).
  4. Overvoltage Protection:

    • Implement overvoltage protection circuits to safeguard against voltage spikes that can exceed the maximum drain-source voltage (VDSS).
  5. Thermal Management:

    • Monitor the junction temperature (TJ) to ensure it does not exceed 175°C.
    • Use thermal paste between the device and heatsink to improve heat dissipation.
  6. Storage:

    • Store the device in a dry, cool environment to prevent moisture damage.
    • Keep the device away from direct sunlight and high temperatures.
  7. Testing:

    • Perform initial testing at low power levels to verify correct operation before applying full load conditions.
    • Use appropriate test equipment and follow safety guidelines to avoid injury or damage to the device.
(For reference only)

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