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LM2694MT

Specifications

SKU: 12404094

BUY LM2694MT https://www.utsource.net/itm/p/12404094.html

Parameter Symbol Conditions Min Typ Max Unit
Input Voltage VIN Continuous 2.95 - 5.5 V
Output Voltage VOUT Fixed - 3.3 - V
Output Current IOUT Continuous - 1.5 - A
Quiescent Current IQ No Load - 0.75 - mA
Dropout Voltage VDROPOUT IOUT = 1.5A - 0.5 - V
Power Dissipation PD VIN = 5V, VOUT = 3.3V, IOUT = 1.5A - 2.55 - W
Operating Temperature TOPR - -40 - 125 °C
Storage Temperature TSTG - -65 - 150 °C

Instructions for Using LM2694MT

  1. Input Voltage (VIN):

    • Ensure the input voltage is within the range of 2.95V to 5.5V.
    • Use appropriate decoupling capacitors (typically 10μF and 0.1μF) close to the input pin to filter out noise.
  2. Output Voltage (VOUT):

    • The LM2694MT has a fixed output voltage of 3.3V. No external resistors are needed to set the output voltage.
  3. Output Current (IOUT):

    • The device can provide a continuous output current of up to 1.5A. Ensure the load does not exceed this limit to avoid overheating or damage.
  4. Quiescent Current (IQ):

    • The quiescent current is typically 0.75mA with no load. This is important for low-power applications.
  5. Dropout Voltage (VDROPOUT):

    • The dropout voltage is typically 0.5V at full load (1.5A). Ensure the input voltage is at least 0.5V higher than the output voltage to maintain regulation.
  6. Power Dissipation (PD):

    • Calculate power dissipation as ( PD = (VIN - VOUT) times IOUT ). For example, at VIN = 5V, VOUT = 3.3V, and IOUT = 1.5A, PD = 2.55W. Ensure proper heat sinking if the power dissipation is high.
  7. Operating Temperature (TOPR):

    • The operating temperature range is from -40°C to 125°C. Ensure the device operates within this range to avoid thermal shutdown or damage.
  8. Storage Temperature (TSTG):

    • Store the device between -65°C and 150°C to ensure long-term reliability.
  9. PCB Layout:

    • Place the input and output capacitors as close as possible to the respective pins to minimize parasitic inductance.
    • Use wide traces for the input and output paths to reduce resistance and inductance.
  10. Thermal Considerations:

    • If the power dissipation is high, use a heatsink or a thermal pad to improve heat dissipation.
    • Monitor the temperature of the device during operation to ensure it does not exceed the maximum operating temperature.

By following these guidelines, you can ensure reliable and efficient operation of the LM2694MT in your application.

(For reference only)

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