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Specifications
SKU: 12404098
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Supply Voltage | VDD | 1.7 to 5.5 | V |
| Operating Current | IDD | 1.5 | μA |
| Output Current (Max) | IOUT | 100 | mA |
| Output Voltage | VOUT | 1.8, 2.5, 3.0, 3.3, 5.0 | V |
| Dropout Voltage | VDROPOUT | 0.2 | V |
| Load Regulation | ±1% | ||
| Line Regulation | ±1% | ||
| Ripple Rejection | 60 dB | ||
| Operating Temperature | Toper | -40 to +85 | °C |
| Storage Temperature | Tstg | -65 to +150 | °C |
| Package | SOT-23 |
Instructions for Using MIP0223SY
Supply Voltage (VDD):
- Ensure the supply voltage is within the range of 1.7V to 5.5V.
- Use appropriate decoupling capacitors (typically 10μF and 0.1μF) close to the input pin to filter out noise and stabilize the supply.
Output Voltage (VOUT):
- The output voltage is fixed and can be selected from 1.8V, 2.5V, 3.0V, 3.3V, or 5.0V depending on the specific part number.
- Use a suitable output capacitor (typically 10μF) to stabilize the output and reduce ripple.
Output Current (IOUT):
- The maximum output current is 100mA. Ensure that the load does not exceed this limit to avoid damage to the device.
Dropout Voltage (VDROPOUT):
- The dropout voltage is 0.2V. This means the input voltage must be at least 0.2V higher than the output voltage to ensure proper regulation.
Load and Line Regulation:
- The load and line regulation are both ±1%. This ensures that the output voltage remains stable under varying load conditions and input voltages.
Ripple Rejection:
- The device provides 60dB ripple rejection, which helps in maintaining a clean output voltage even when the input has significant ripple.
Operating and Storage Temperature:
- The operating temperature range is -40°C to +85°C, and the storage temperature range is -65°C to +150°C. Ensure that the device is used within these limits to avoid performance degradation or failure.
Package:
- The device is available in a SOT-23 package, which is small and easy to solder. Ensure proper handling and soldering techniques to avoid damage to the device.
Mounting and PCB Layout:
- Place the device close to the load to minimize trace resistance and inductance.
- Use wide and short traces for power and ground connections to reduce parasitic effects.
- Ensure adequate thermal management if the device is expected to operate near its maximum current or in high ambient temperatures.
Testing:
- Before finalizing the design, test the device under various operating conditions to ensure it meets the required specifications and performance criteria.
Inquiry - MIP0223SY
