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cd7388cz

Specifications

SKU: 12420152

BUY cd7388cz https://www.utsource.net/itm/p/12420152.html

Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage Vcc Operating 4.5 5.0 5.5 V
Output Current per Pin Iout Continuous - 25 50 mA
Total Output Current Itotal All outputs - 100 150 mA
High-Level Input Voltage VIH 2.0 - 5.5 V
Low-Level Input Voltage VIL 0 - 0.8 V
High-Level Output Voltage VOH IO = -0.4 mA 2.4 - 5.0 V
Low-Level Output Voltage VOL IO = 16 mA 0 - 0.5 V
Propagation Delay Time tpd - 12 35 ns
Power Dissipation PD Maximum - - 625 mW
Operating Temperature Topr -40 - 85 °C
Storage Temperature Tstg -65 - 150 °C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the specified range of 4.5V to 5.5V.
    • Use appropriate decoupling capacitors (e.g., 0.1 μF) close to the Vcc pin to stabilize the power supply.
  2. Output Current:

    • Each output pin can source or sink up to 50 mA continuously.
    • The total current drawn from all outputs combined should not exceed 150 mA.
  3. Input Levels:

    • High-level input voltage (VIH) should be at least 2.0V and can go up to 5.5V.
    • Low-level input voltage (VIL) should be no more than 0.8V.
  4. Output Levels:

    • When sourcing current (IO = -0.4 mA), the high-level output voltage (VOH) should be at least 2.4V.
    • When sinking current (IO = 16 mA), the low-level output voltage (VOL) should not exceed 0.5V.
  5. Propagation Delay:

    • The propagation delay time (tpd) is typically 12 ns but can be as high as 35 ns.
  6. Thermal Management:

    • The device can dissipate up to 625 mW of power.
    • Ensure adequate heat dissipation if operating near the maximum power dissipation.
  7. Temperature Range:

    • The operating temperature range is -40°C to 85°C.
    • The storage temperature range is -65°C to 150°C.
  8. Handling:

    • Handle the device with care to avoid static damage.
    • Follow standard ESD (Electrostatic Discharge) precautions when handling and soldering the device.
  9. Mounting:

    • Ensure proper mounting and soldering techniques to avoid mechanical stress on the pins and the package.
  10. Testing:

    • Test the device under typical operating conditions to ensure it meets the specified parameters.
(For reference only)

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