Specifications
SKU: 12420152
Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
Supply Voltage | Vcc | Operating | 4.5 | 5.0 | 5.5 | V |
Output Current per Pin | Iout | Continuous | - | 25 | 50 | mA |
Total Output Current | Itotal | All outputs | - | 100 | 150 | mA |
High-Level Input Voltage | VIH | 2.0 | - | 5.5 | V | |
Low-Level Input Voltage | VIL | 0 | - | 0.8 | V | |
High-Level Output Voltage | VOH | IO = -0.4 mA | 2.4 | - | 5.0 | V |
Low-Level Output Voltage | VOL | IO = 16 mA | 0 | - | 0.5 | V |
Propagation Delay Time | tpd | - | 12 | 35 | ns | |
Power Dissipation | PD | Maximum | - | - | 625 | mW |
Operating Temperature | Topr | -40 | - | 85 | °C | |
Storage Temperature | Tstg | -65 | - | 150 | °C |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (Vcc) is within the specified range of 4.5V to 5.5V.
- Use appropriate decoupling capacitors (e.g., 0.1 μF) close to the Vcc pin to stabilize the power supply.
Output Current:
- Each output pin can source or sink up to 50 mA continuously.
- The total current drawn from all outputs combined should not exceed 150 mA.
Input Levels:
- High-level input voltage (VIH) should be at least 2.0V and can go up to 5.5V.
- Low-level input voltage (VIL) should be no more than 0.8V.
Output Levels:
- When sourcing current (IO = -0.4 mA), the high-level output voltage (VOH) should be at least 2.4V.
- When sinking current (IO = 16 mA), the low-level output voltage (VOL) should not exceed 0.5V.
Propagation Delay:
- The propagation delay time (tpd) is typically 12 ns but can be as high as 35 ns.
Thermal Management:
- The device can dissipate up to 625 mW of power.
- Ensure adequate heat dissipation if operating near the maximum power dissipation.
Temperature Range:
- The operating temperature range is -40°C to 85°C.
- The storage temperature range is -65°C to 150°C.
Handling:
- Handle the device with care to avoid static damage.
- Follow standard ESD (Electrostatic Discharge) precautions when handling and soldering the device.
Mounting:
- Ensure proper mounting and soldering techniques to avoid mechanical stress on the pins and the package.
Testing:
- Test the device under typical operating conditions to ensure it meets the specified parameters.
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