Instructions for Use:

1. Handling Precautions:

   • Handle the module with care to avoid mechanical damage.
   • Use proper ESD (Electrostatic Discharge) protection to prevent damage to the device.

2. Mounting:

   • Ensure that the mounting surface is flat and clean.
   • Apply thermal grease or a thermal pad between the module and the heat sink for optimal thermal performance.
   • Tighten the mounting screws to the recommended torque value to ensure good thermal contact.

3. Electrical Connections:

   • Connect the collector, emitter, and gate terminals correctly.
   • Use short and thick wires to minimize inductance and resistance.
   • Ensure that the gate drive circuit provides the correct voltage levels and sufficient current to switch the IGBT on and off.

4. Thermal Management:

   • Monitor the junction temperature to ensure it stays within the specified range.
   • Use a suitable heat sink to dissipate the heat generated by the module.
   • Consider forced air cooling if the natural convection is insufficient.

5. Operational Parameters:

   • Do not exceed the maximum ratings for voltage, current, and temperature.
   • Ensure that the gate-emitter voltage is within the specified limits to avoid damage to the IGBT.
   • Operate the IGBT within its safe operating area (SOA) to prevent thermal runaway.

6. Storage:

   • Store the module in a dry and cool environment.
   • Avoid exposure to high humidity and extreme temperatures.

7. Testing:

   • Before installing the module in the final application, test it under controlled conditions to ensure proper functionality.
   • Use a curve tracer or other appropriate test equipment to verify the electrical parameters.

8. Documentation:

   • Refer to the datasheet and application notes for detailed information and specific recommendations.
   • Keep a record of the installation and testing procedures for future reference.