Instructions for Use

1. Power Supply:

   • Ensure the supply voltage is within the specified range (3.0V to 5.5V).
   • Use a stable power source with adequate current capacity.

2. Grounding:

   • Connect the ground (GND) pin to a common ground point to ensure proper operation and minimize noise.

3. Input Signal:

   • Apply the input signal to the IN+ and IN- pins.
   • The input sensitivity is 1.0Vrms for full-scale output.

4. Output Configuration:

   • Connect the speaker to the OUT+ and OUT- pins.
   • Ensure the speaker impedance matches the recommended load (4Ω).

5. Thermal Management:

   • Place the device on a PCB with adequate thermal vias and copper planes to dissipate heat.
   • Avoid operating the device at temperatures outside the specified range (-40°C to 85°C).

6. Protection Features:

   • The device includes over-temperature protection, short-circuit protection, and thermal shutdown.
   • Ensure these features are not triggered by maintaining proper operating conditions.

7. Layout Considerations:

   • Keep signal traces short and direct to minimize noise and interference.
   • Use decoupling capacitors close to the power supply pins to filter out noise.

8. Software Configuration:

   • If applicable, configure the device using the I2C or SPI interface according to the datasheet specifications.
   • Refer to the datasheet for detailed register maps and configuration settings.

9. Testing:

   • Test the device under typical operating conditions to ensure it meets performance specifications.
   • Monitor the output power and THD+N to verify correct operation.

10. Storage and Handling:

    • Store the device in a dry, cool place to prevent moisture damage.
    • Handle the device with care to avoid static discharge and physical damage.