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MBI6662GD-A

Specifications

SKU: 12447254

BUY MBI6662GD-A https://www.utsource.net/itm/p/12447254.html

Parameter Symbol Conditions Min Typical Max Unit
Supply Voltage VCC - 3.0 - 5.5 V
Output Current IO Per Channel 0 - 150 mA
Operating Temperature TOPR - -40 - 85 °C
Storage Temperature TSTG - -55 - 150 °C
Thermal Resistance (Junction to Ambient) RθJA - - 85 - °C/W
Maximum Power Dissipation PD TA = 25°C - - 1200 mW
Input Voltage High Level VIH - 2.0 - 5.5 V
Input Voltage Low Level VIL - 0 - 0.8 V
Propagation Delay Time tpd VCC = 5V, IO = 50mA 0 20 40 ns
Rise Time tr VCC = 5V, IO = 50mA 0 10 30 ns
Fall Time tf VCC = 5V, IO = 50mA 0 10 30 ns

Instructions for MBI6662GD-A:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 3.0V to 5.5V.
    • Use appropriate decoupling capacitors (e.g., 0.1μF ceramic capacitors) close to the power pins to reduce noise and stabilize the supply.
  2. Output Current:

    • The maximum output current per channel is 150mA. Ensure that the load does not exceed this limit to avoid damage.
    • If multiple channels are used simultaneously, ensure the total power dissipation does not exceed the maximum power dissipation rating.
  3. Temperature:

    • Operate the device within the temperature range of -40°C to 85°C for optimal performance.
    • Store the device in an environment with temperatures between -55°C and 150°C.
  4. Input Signals:

    • The input voltage high level (VIH) should be at least 2.0V and can go up to 5.5V.
    • The input voltage low level (VIL) should be no more than 0.8V.
  5. Timing Parameters:

    • The propagation delay time (tpd) is typically 20ns but can vary between 0ns and 40ns.
    • The rise time (tr) and fall time (tf) are typically 10ns but can vary between 0ns and 30ns.
  6. Power Dissipation:

    • The maximum power dissipation at 25°C ambient temperature is 1200mW. Ensure adequate heat sinking or cooling if operating near this limit.
  7. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal circuits.
    • Follow proper soldering techniques to prevent thermal shock and mechanical stress during assembly.
  8. Application Notes:

    • Refer to the datasheet for detailed application notes and circuit diagrams to ensure correct usage and integration into your design.
(For reference only)

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