Specifications
SKU: 12447254
Parameter | Symbol | Conditions | Min | Typical | Max | Unit |
---|---|---|---|---|---|---|
Supply Voltage | VCC | - | 3.0 | - | 5.5 | V |
Output Current | IO | Per Channel | 0 | - | 150 | mA |
Operating Temperature | TOPR | - | -40 | - | 85 | °C |
Storage Temperature | TSTG | - | -55 | - | 150 | °C |
Thermal Resistance (Junction to Ambient) | RθJA | - | - | 85 | - | °C/W |
Maximum Power Dissipation | PD | TA = 25°C | - | - | 1200 | mW |
Input Voltage High Level | VIH | - | 2.0 | - | 5.5 | V |
Input Voltage Low Level | VIL | - | 0 | - | 0.8 | V |
Propagation Delay Time | tpd | VCC = 5V, IO = 50mA | 0 | 20 | 40 | ns |
Rise Time | tr | VCC = 5V, IO = 50mA | 0 | 10 | 30 | ns |
Fall Time | tf | VCC = 5V, IO = 50mA | 0 | 10 | 30 | ns |
Instructions for MBI6662GD-A:
Power Supply:
- Ensure the supply voltage (VCC) is within the range of 3.0V to 5.5V.
- Use appropriate decoupling capacitors (e.g., 0.1μF ceramic capacitors) close to the power pins to reduce noise and stabilize the supply.
Output Current:
- The maximum output current per channel is 150mA. Ensure that the load does not exceed this limit to avoid damage.
- If multiple channels are used simultaneously, ensure the total power dissipation does not exceed the maximum power dissipation rating.
Temperature:
- Operate the device within the temperature range of -40°C to 85°C for optimal performance.
- Store the device in an environment with temperatures between -55°C and 150°C.
Input Signals:
- The input voltage high level (VIH) should be at least 2.0V and can go up to 5.5V.
- The input voltage low level (VIL) should be no more than 0.8V.
Timing Parameters:
- The propagation delay time (tpd) is typically 20ns but can vary between 0ns and 40ns.
- The rise time (tr) and fall time (tf) are typically 10ns but can vary between 0ns and 30ns.
Power Dissipation:
- The maximum power dissipation at 25°C ambient temperature is 1200mW. Ensure adequate heat sinking or cooling if operating near this limit.
Handling:
- Handle the device with care to avoid static discharge, which can damage the internal circuits.
- Follow proper soldering techniques to prevent thermal shock and mechanical stress during assembly.
Application Notes:
- Refer to the datasheet for detailed application notes and circuit diagrams to ensure correct usage and integration into your design.
Inquiry - MBI6662GD-A