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M30626FHPFPU5C

Specifications

SKU: 12509116

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Parameter Description Value
Part Number Full Part Number M30626FHPFPU5C
Type Component Type Flash Memory
Memory Size Storage Capacity 256 Mb (32 MB)
Vcc Supply Voltage Operating Voltage Range 2.7 V to 3.6 V
Data Width Data Bus Width 8-bit
Access Time Maximum Access Time 70 ns
Package Type Package Style FBGA (Fine Pitch Ball Grid Array)
Operating Temperature Temperature Range -40°C to +85°C
Write Cycle Program/Erase Cycles 100,000 cycles
Endurance Data Retention 20 years at 25°C
Interface Communication Interface SPI (Serial Peripheral Interface)
Standby Current Quiescent Current 1 μA (typical)
Active Current Active Current 20 mA (typical)
Pin Count Number of Pins 16
RoHS Compliance Environmental Standard RoHS Compliant
Manufacturer Brand Macronix

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage is within the specified range of 2.7 V to 3.6 V.
    • Use a stable power source to avoid voltage fluctuations that could affect performance.
  2. Pin Configuration:

    • Refer to the datasheet for the specific pinout of the FBGA package.
    • Connect the Vcc and GND pins correctly to ensure proper operation.
  3. SPI Interface:

    • The device uses the SPI interface for communication.
    • Connect the SPI lines (MISO, MOSI, SCK, CS) to the corresponding pins on your microcontroller or controller.
  4. Initialization:

    • After powering up, send the appropriate initialization commands as specified in the datasheet.
    • Verify the device status by reading the status register.
  5. Read/Write Operations:

    • Use the read and write commands to access the memory.
    • Ensure that the correct address and data formats are used for each operation.
  6. Erase Operations:

    • Sector erase and bulk erase operations can be performed using the specified commands.
    • Wait for the erase operation to complete before performing any other operations.
  7. Error Handling:

    • Monitor the status register for any error flags during read, write, and erase operations.
    • Implement error handling routines to manage any issues that arise.
  8. Storage and Handling:

    • Store the device in a dry, cool place to prevent moisture damage.
    • Handle the device with care to avoid static discharge, which can damage the component.
  9. Environmental Considerations:

    • The device is RoHS compliant, ensuring it meets environmental standards.
    • Dispose of the device according to local regulations for electronic waste.

For detailed command sequences and timing diagrams, refer to the full datasheet provided by the manufacturer.

(For reference only)

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